Call for Participation

Requirements for Submission
Provide an abstract of up to 200 words that summarizes technical and previously unpublished work covering case histories, research and discoveries.

Poster Presenter Benefits
Poster presenters are entitled to a free One-Day Conference Pass for Tuesday, January 25th

Best Technical Poster – USD 750
Eligibility: Open to all poster submissions

Acceptance/status of submitted abstracts
Wednesday, December 15, 2021

Signed poster presenter agreements are due 
Friday, December 20, 2021

Submit Call for Posters

For more information about poster participation, contact Toya Richardson, IPC technical programs coordinator.

Submit Technical Paper Abstract

Conference Paper Timeline

• Acceptance/status of your submittal by 8/20 through 9/24
• Papers are due Friday, October 8, 2021, through Friday, November 12, 2021
• Presentations are due Friday, November 12, 2021, through Friday, December 10, 2021
• Recordings are due Friday, December 10, 2021, through Friday, December 17, 2021

Requirements for Submission

Provide an abstract of approximately 300 words that summarizes technical work, covering case histories, research and discoveries. Authors of papers selected for the conference will each receive a detailed speaker manual to assist them with numerous items, including the formatting of their papers and presentation slides.

The selection process is competitive and sufficient detail needs to be included to allow the Technical Program Committee to properly assess content of the proposed paper. The paper should be noncommercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Presentations will be limited to 30 minutes, which includes approximately 5 minutes for questions and answers.

Conference Benefits

Conference speakers are entitled to a free one-day conference pass for the day of their presentations, discounted registration fees for the full conference and complimentary admission to the exhibit hall.

All speakers selected for papers who provide both their paper and presentation to IPC by October 15, 2021 will be eligible for a free full-conference pass. 

Conference Awards

To recognize exceptional achievement, awards will be presented for "Best Paper." Each award consists of a recognition plaque for each author and a $1,000 prize. IPC leaves it to the primary discretion on how the honorarium should be distributed.

Please Note

Previously published papers and/or commercially focused papers are not appropriate and will not be accepted. 

For more information about conference participation, please contact Toya Richardson at ToyaRichardson@ipc.org or +1 847-597-2825.

Submit Course Proposal 

Course proposals are solicited from individuals interested in teaching half-day (three-hour) professional development courses on design, manufacturing processes and materials. Travel expenses and honorariums are offered to professional development instructors.

Professional Development Timeline

• Proposals due July 16, 2021
• Acceptance by August 20, 2021
• Final presentation revisions due December 17, 2021

For more information about professional development, please contact Andrea Keefe at AndreaKeefe@ipc.org or +1 847-597-2879.

Abstract and Proposal Instructions

Submit your Technical Paper Abstract or Professional Development Course Proposal online.

• 3D Printing/Additive Manufacturing in Electronics
• 4D Smart Material Printing
• AI-Enabled Inspection
• Artificial Intelligence (AI)/Machine Learning
• Augmented Reality/Virtual Reality
• Automation
• Blockchain
• Connected Factory Exchange (CFX)
• Cybersecurity
• Data Analytics/Big Data/Business Intelligence (BI)
• Digital Transformation of Operations and Supply Chain
• Digital Twin/Digital Thread
• Industrial Internet of Things (IIoT)
• Industrial Networks (IT/OT Convergence)
• Industry 4.0
• Robotics/Cobots
• Simulation and Modeling
• Smart Factory
• Smart Sensor/Actuator Technologies
• Systems Integration

• Microminiaturization 
• Nanotechnology 
• E-textiles and Smart Textiles
• Energy Harvesting
• Flexible Hybrid Electronics
• Graphene in Electronics Manufacturing
• LED Manufacturing
• Optoelectronics
• Photovoltaics
• Sensors and Haptics
• Wearables

• Automotive
• Biotech
• Class 3+
• Harsh Environments
• Power Electronics
  • Battery technologies
• Ruggedization
• Space/Avionics

• 5G
• Additive and Semi-Additive Processes
• Black Pad and Other Board Related Defects
• CAF
• HDI Technology
• High Frequency
• High Speed
• High Voltage (for Automotive Applications)
• Microvia Design and Testing
• PCB/Pad Repair
• RF Materials
• Signal Integrity 
• Solderability
• Surface Finishes
• Via Plugging and Other Protection

• Design for Excellence (DFX)
• Design for Manufacturability (DFM)
• Design for Test (DFT)
• Embedded Passive and Active Devices
  • CAD Design Tools
• Printed Electronics
• Flexible Circuits
• RFID Circuitry
• 2.5-D/3-D Component Packaging
• Package on Package
• Flip Chip/0201 Metric
• Re-balling Components
• Connectors
• Die attach
• Semiconductor
• Wire Bonding
  • Ultra-thin die assembly
• BGA Packaging

• Accelerated Life Testing
• Automated Inspection (SPI, AOI, AXI)
  • Solder Paste Inspection (SPI)
  • Automated Optical Inspection (AOI)
  • Automated X-ray Inspection (AXI)
• Failure Analysis
• In-circuit Testing (ICT)
• Inspection Methods
• Microvia Interface Failures
• Process Control
• Reliability after Repair or Rework
• Surface Reliability
  • Corrosion
  • Electromigration
  • Objective Evidence
  • Surface Insulation Resistance Testing (SIR)
• Test Method Developments
• Tin Whiskers

• BTC/LGA/QFN Assembly Challenges
• Press-fit/Compliant Pin Technology
• Cleaning
• Coating Processes
• Electronics Manufacturing Services
• Novel Solder Deposition Methods
• Process Best Practices
• Reflow Ovens and Profiling
• Rework Process
• Robotic, Laser and Selective Soldering Processes
• Stencil Printing
• Surface Preparation Methods
• Surface Mount Technology (SMT) Process
• Vapor Phase
• Warpage-induced Defect Mitigation

• Adhesives
• Conformal Coatings
• High Temperature Alloys
• Material Evaluation Methods
• Pb-free Alloys
  • Low temperature soldering 
• Sintering Materials
• Thermal Interface Materials (TIMs)
• Underfills

• Corporate Sustainability Reporting
  • Holistic policies and practices for the environment, social factors, and corporate governance
• Environmental and human rights due diligence
• Human health, worker health, and environmental protection and compliance
• Responsible supply chain management
  • Responsible sourcing
• Sustainable and safe chemicals and products
  • Alternative chemistries and processes
• Traceability and transparency to support materials declarations