The APEX EXPO Technical Conference You Rely On Transformed!
For over 25 years, the APEX EXPO Technical Conference has been a trusted forum for showcasing breakthrough research, fostering engineering collaboration, and advancing innovation across electronics manufacturing. In 2026, that legacy continues under a new name.
Advanced Electronic Packaging Conference 2026
Component- to System-Level Integration
This isn’t just a new name—it’s a strategic evolution that reflects the growing convergence of packaging, interconnect, and manufacturing technologies at every level of integration. While the format and scope of the conference are being transformed, the technical content our industry relies on is not only being preserved—it’s being expanded to better reflect today’s full component-to-system-level view.
Call for Participation
Be on the forefront as the APEX EXPO conference enters this new era. Submit your proposal to present at the Advanced Electronic Packaging Conference 2026.
Why Present at Advanced Electronic Packaging Conference 2026?
- Elevate Your Visibility to a Global Audience
Your accepted paper will be published in the official Conference Proceedings and archived online—giving your work long-lasting exposure to a global community of technical leaders, decision-makers and innovators. - Influence the Future of Electronics
This is where the industry comes together to share real-world results, emerging technologies, and forward-looking insights. Presenting at Advanced Electronic Packaging Conference 2026 puts you at the center of progress in design, materials, assembly, testing, reliability, and digital manufacturing. - Global, Peer-Reviewed Program
Speaking slots are highly competitive and limited. Selection by the Technical Program Committee signals excellence and technical rigor and positions you as a thought leader in your field.
What Topics Are We Looking For?
The Technical Program Committee welcomes submissions across the seven technical focus areas (subtopics included as reference only):
-
Design & Simulation
High-speed, RF/mmWave, optical and thermal simulation; codesign for chiplets and system integration; AI-optimized design -
Materials
Substrates, interposers, adhesives, TIMs, coatings, sustainable materials, next-generation solder alloys -
Advanced PCB Fabrication
SAP/mSAP, hybrid stackups, microvias, drilling, plating, additive manufacturing processes -
Assembly, Test & Manufacturing
Fine-pitch placement, co-packaged optics, power module assembly, inline test automation -
Quality, Reliability & Metrology
Harsh environments, lifecycle modeling, intermetallics, embedded reliability, high-voltage testing -
Digital Manufacturing
AI in inspection, predictive analytics, smart factory integration, cybersecurity, process automation -
Sustainability
Circular materials, Scope 1 & 2 reporting, design for lifetime optimization
Abstracts Now Being Accepted
We seek abstracts for technical paper presentations, posters and professional development courses that describe significant results from research work, highlight new techniques or materials, and discuss cutting-edge trends and challenges facing component- and subsystem-level integration.
Highest priority will be given to abstracts that match the Advanced Electronic Packaging Conference 2026 topics list.
Submit Your Early Indication of Interest
Conference speaking slots will be of high value and very limited. Because of this, we strongly recommend registering your early Indication of Interest now by entering your contact information and proposed paper topic in the Oxford Abstracts system (links below). Providing this Indication of Interest today while you wait for final travel or abstract approval may put you into a lead position for a speaking slot as the Technical Program Committee reviews abstracts for sessions.
Abstract Submission Guidelines
Technical Papers and Posters: Provide an abstract of a maximum of 250 words that summarizes previously unpublished technical work, covering case histories, research, and discoveries. The selection process is competitive, so sufficient detail needs to be included to enable the Technical Program Committee to properly assess the content of the proposal. The content must be noncommercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results.
All authors will be asked to agree to the Global Electronics Association's Commercialism Policy. Previously published papers and/or commercially focused papers, posters, and presentations will not be accepted. This applies to oral presentations, text and figures (presentation slides, papers, and posters).
Deadlines:
- Technical Paper Indication of Interest: July 31, 2025
- Technical Paper Abstract: September 12, 2025
- Poster Abstract: December 1, 2025
No late abstracts will be accepted.
Paper and Poster Abstracts will be reviewed and scored based on the following criteria:
1. Novelty/Innovativeness
2. Technical Merit
3. Relevance
4. Quality and Readability
5. Adherence to IPC's Non-commercialism Policy
Professional Development Courses: Provide an abstract of a maximum of 250 words that summarizes the topic(s) to be covered in the course, intended target audience, learning objectives, number of three-hour sessions necessary for the topic, and any preferred prior knowledge needed for success in the course. Courses are offered as one 3-hour session or two 3-hour sessions (offered as Part 1 and Part 2 for a total of 6 hours).
Instructors selected for the conference will receive further guidance on formatting and presentation slides.
Honoraria and travel expense stipends ($750 honorarium + $1,000 travel) are offered to professional development instructors.
Deadline:
- Professional Development Course Abstract: September 19, 2025
Conference Awards
Top papers and posters are eligible for the following awards:
- Best of Conference Technical Paper
- NextGen Best Paper
- Best Student Research Paper
- Best Technical Poster
Each award includes a recognition plaque and honorarium. Eligibility requires meeting all submission and deadline criteria.
Questions
For more information about participating in Advanced Electronic Packaging Conference 2026 as an author/presenter or professional development course instructor, please contact the Global Electronics Association's Conference and Events Manager, Julia Flynn, by email at juliaflynn@electronics.org.