Electronic Circuits World Convention 16 (ECWC16)
Hosted by IPC at APEX EXPO 2024
Supported by The World Electronic Circuits Council

Call for Participation: Conference Papers and Posters

Submit a Paper AbstractSubmit a Poster Abstract

| Click Here for Professional Development Course Information |

IPC invites engineers, researchers, academics, students, technical experts, and industry leaders to submit abstracts for the Electronic Circuits World Convention 16 (ECWC16) Technical Conference hosted by IPC APEX EXPO 2024. All submissions will be non-commercial in nature, in accordance with IPC's Non-Commercialism Policy.

Technical Conference Session

IPC welcomes abstracts summarizing original and previously unpublished work covering case histories, research, and discoveries. Authors may submit abstract(s) to be considered for paper(s) with corresponding podium presentation(s) and/or may submit abstract(s) for poster presentation(s). See below for more details about presentation options.

Papers with Podium Presentations: Abstracts will be peer-reviewed by members of the Technical Program Committee. Authors of selected abstracts will be notified and invited to submit technical papers and slide decks (for podium presentations) for peer review. Authors invited to submit a paper will receive further guidance on formatting papers and presentation slides. Accepted papers will be published in a proceedings document at the conclusion of the conference, and authors will deliver podium presentations in person at ECWC16 at IPC APEX EXPO 2024 in Anaheim, California, USA. Presentations will be limited to 30 minutes, inclusive of a 20- to 25-minute presentation followed by Q&A.

Poster Presentations: Abstracts will be peer-reviewed by members of the Technical Program Committee. Authors of selected abstracts will be notified and invited to submit research posters for peer-review. IPC will provide a template for consistent poster formatting and information about poster printing options. Accepted posters will be displayed in a centrally located area near the Technical Conference sessions. Poster authors will participate in dedicated Poster Networking Sessions for increased visibility, and for the purposes of Best Poster Judging.

Topics for Technical Conference Papers, Technical Posters, and Professional Development Courses

Comprehensive list but does not claim to be definitive. Other appropriate topics will also be given consideration.

Quality, Reliability, Test and Inspection
  • Qualification
    • Component Qualification - SMT, PTH, Press-fit/Compliant Pin
    • Connectors and Qualification
    • Metrology and Assessment
    • Accelerated Life Testing
  • Quality
    • Quality Management Systems
    • Statistical Process Control and Optimization, Yields
    • Lean Manufacturing (Six Sigma Approaches)
  • Reliability
    • Reliability Studies and Results
    • Materials Characterization and Assessment
    • Failure Analysis
    • Defect Mechanisms
    • Test Vehicle Study Results
    • Measurement System Analysis, Gauge R&R
    • Thermomechanical Reliability
  • Inspection and Test
    • In-line Inspection Processes
    • Inspection Methods
    • Test Method Development
    • Electrical Test (ICT, FCT, J-TAG)
    • Automated Inspection – SPI, AOI, AXI
  • Design for Excellence - DfX, DfM, DfT
  • Design for Board Fab, Physical Design
  • Advanced Packaging Design
  • Electro-Mechanical Design
PCB Fabrication and Materials
  • Laminate Materials – Cores, Prepregs
  • Novel PCB Materials – Organic, Build-up
  • RF Materials, Low-Loss Materials
  • Vias – Design, Formation, Construction/Stacking, Plating, Plugging
  • Printed Board Platings and Surface Finishes
  • Additive, Semi-Additive Build-up Technologies
  • Flexible and Hybrid Circuits
HDI, uHDI and Substrates
  • HDI, uHDI/Fine Circuit Fabrication, Processes and Equipment
  • Laminate, Core Materials
  • IC Substrate Technologies
  • Build-up Materials
  • Microvia Design, Processes and Testing
  • Microvia Interface Reliability
  • Embedded Technologies (die/bridge/components)
Electronic Assembly Materials
  • Materials Performance
    • Solders, Alloys
    • Sintering Materials
    • Fluxes
    • Thermal Interface Materials (TIMs)
    • Underfills, Edge-Bond, Corner-Bond
    • Adhesives
    • Potting Compounds and Encapsulants
    • Low Pressure Molding Materials
  • Cleaning and Coating
    • Cleaning Chemistries
    • Conformal Coatings
Assembly Processes
  • uPCBA and Component Assembly Processes
    • Ultra Complex PCBA, High Density Assembly
    • First-level Component and Module Assembly
    • New Chiplet Architectures, Next-generation Packages
    • Microelectronic and Power Electronic Technologies
  • PCBA Assembly Processes
    • Second-Level Interconnect Assembly
    • Processes – SMT, Wave-Selective, Press-fit, Vapor Phase, Laser
  • Rework and Repair
    • Rework Processes – Laser, Hot Gas, Solder Fountain, Press Fit, and Manual Repair
    • Quality and Reliability Assessment of Reworked and Repaired Devices
  • Backend of Line Processes
    • Backend Mechanical Assembly Processes
    • Sub-system, Final System Assembly and Test
Factory of the Future Implementation
  • Data and Data Analytics
    • Digital Transformation
    • Process Control - Real Time, Data-Driven
    • CAD, 3D Design, Simulation, Modeling
    • Digital Thread, Digital Twin
    • Cybersecurity
    • IT/OT Convergence
    • Blockchain, Digital Supply Chain, Digital Product Passport
    • Supply Chain Traceability and Transparency
  • Automation
    • Connected Factory Exchange (CFX)
    • Robotics, Cobots
    • Industry 4.0 / Smart Factory – OEM, EMS, PCB, Advanced Packaging
    • Sensors
  • Artificial Intelligence and Machine Learning
    • Use of AI in Automated Inspection
    • AI-Enabled Processes
    • Augmented / Virtual Reality
High Reliability for Extreme Requirements
  • e-Mobility/EV Automotive 
  • Power Electronics
  • Defense and Military Applications
  • Space/Avionics
  • Harsh Environments
  • Ruggedization
Sustainability for Electronics
  • Corporate Sustainability Reporting and Due Diligence
  • Responsible Sourcing/Supply Chain
  • Materials Declarations and Communication
  • Eco-design
  • Policies, Environmental Protection and Compliance
  • Environmental, Energy, Water Management
  • Life Cycle Assessment
  • Safer, Sustainable, Alternative Chemistries, Materials, and Processes
  • Worker Health and Safety
  • Environmental Health
Emerging Technologies
  • Optoelectronics
  • RF-5G/6G-mm Wave Requirements
  • Nanotechnology
  • 3D Plastronics
  • Additive Manufactured Electronics
  • Printed Electronics
Market Trends and Outlook
  • Global and Regional Market Shifts
  • PCB, Materials, Equipment, Advanced Packaging, Assembly and End Products
  • Business Models and Strategy
  • Barriers and Challenges
  • Supply Chain Management

Paper and Poster Abstracts will be reviewed and scored based on the following criteria:

  1. Novelty/Innovativeness
  2. Technical Merit
  3. Relevance
  4. Quality and Readability
  5. Adherence to IPC's Non-Commercialism Policy

All abstract submissions should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest, and contain appropriate technical test results.

The focus of this presentation may not be commercial in nature. Promotion of specific company, products, or services is not permitted, in accordance with IPC’s Non-Commercialism Policy.

The selection process is competitive. Authors are encouraged to include sufficient detail to allow the Technical Program Committee to properly assess the technical merit of the proposed presentation.

Timeline for Technical Paper Presentations:

Submit a Paper Abstract

  • Paper Abstracts Submissions Due — September 18, 2023
  • Invited Paper Submissions Due — November 20, 2023
  • Accepted and Revised Paper Submissions Due — January 8, 2024 
  • PowerPoint Slides Submissions Due — February 12, 2024

Timeline for Technical Poster Presentations: 

Submit a Poster Abstract

  • Poster Abstracts Submissions Due — January 22, 2024
  • Invited Poster Submissions Due — March 4, 2024

Non-Commercialism Policy and Original Work

All authors and instructors will be asked to agree to IPC’s Non-Commercialism Policy. Previously published papers and/or commercially focused papers, posters, and presentations will not be accepted. This applies to oral presentations, text, and figures (presentation slides, papers, and posters).

Download our Non-Commercialism Policy

Conference Awards

To recognize exceptional achievement, the IPC Technical Program Committee will select top qualifying papers and one top poster for awards. Awards include “Best of Conference,” “NextGen Best Paper,” “Best Student Research Paper,” and “Best Technical Poster.” To qualify, all paper, poster, and presentation deadlines must be met. Each award consists of a recognition plaque for each author and an honorarium.

Attendance and Registration

At least one author is expected to attend in-person at ECWC16 at IPC APEX EXPO 2024 in Anaheim, California. Paper and poster presenting authors are entitled to a free one-day conference pass for the day of their presentations and are eligible for discounted rates if they wish to upgrade their registration. Non-presenting co-authors are not eligible for registration discounts. Presenting authors are responsible for making their own travel and hotel reservations and are encouraged to use the discounted booking options provided by IPC.

Call for Participation
Professional Development Courses

Submit a PD Course Abstract

IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit abstracts for the Professional Development Courses at IPC APEX EXPO 2024. All submissions will be non-commercial in nature, in accordance with IPC's Non-Commercialism Policy.

Professional Development Courses: IPC welcomes abstracts as proposals for courses on all aspects of electronics manufacturing, including design, manufacturing processes, and materials, factory of the future, and emerging technologies.

Abstracts will be reviewed by a committee of IPC staff. Authors of selected abstracts will be notified and invited to be instructors at IPC APEX EXPO 2024. Instructors will be asked to submit course outlines, slides, and resource materials ahead of the meeting dates. 

Courses can be offered as one 3-hour session or two 3-hour sessions (offered as Part 1 & Part 2 for a total of 6 hours). Instructors of courses selected for the Professional Development program will receive further guidance on formatting presentation slides, as well as instructions for instructor registration. Honoraria and travel expense stipends are offered to professional development instructors. Instructors are responsible for making their own travel and hotel reservations, and are encouraged to use the discounted booking options provided by IPC.

Timeline for Professional Development Courses:

Submit a PD Course Abstract

  • PD Course Abstracts Submissions Due — August 28, 2023
  • PowerPoint Slides and Course Materials Submissions Due — February 12, 2024


For more information about participating as a technical conference presenter or professional development course instructor, please contact IPC’s Professional Development and Events Manager, Julia Gumminger, by email at juliagumminger@ipc.org.

Any time that an early career engineer can harness the process of putting together a technical manuscript to convey core research results and methodology used, it shows that they are developing as an engineer. This is invaluable because it not just draws attention to their work, but it can also accelerate their career growth.
Bhanu Sood, Ph.D., Deputy Chief Technologist, NASA Goddard Space Flight Center

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