Call for Participation: Technical Papers, Technical Posters, and Professional Development Courses
IPC is now accepting abstracts for technical paper presentations, posters, and professional development courses at IPC APEX EXPO 2023 in San Diego! IPC APEX EXPO is the premier event for the electronics manufacturing industry. The Technical Conference and Professional Development Courses are two exciting forums within the trade show environment, where technical knowledge is shared from experts in all areas of the electronics industry, including design, materials, assembly, processes, equipment, and Factory of the Future.
IPC seeks abstracts for technical paper presentations and posters that describe significant results from research experiments, highlight new techniques or materials, and/or discuss cutting-edge trends and challenges facing the electronics manufacturing industry. Those selected by the Technical Program Committee will be invited to participate in the IPC APEX EXPO 2023 Technical Conference.
IPC also seeks professional development course abstracts for three-hour sessions of live instruction covering all aspects of electronics manufacturing. Courses can be offered as one 3-hour session or two 3-hour sessions (offered as Part 1 & Part 2 for a total of 6 hours).
Deadline for all abstracts: Monday, June 20, 2022
Presentation Experience at IPC APEX EXPO
Presenting at IPC APEX EXPO 2023 in San Diego will provide significant visibility for you and your company. Thousands of individuals will receive the technical proceedings of the conference, ensuring that your published paper will be seen by key engineers, managers, and executives from all segments of the worldwide electronic interconnection industry.
Technical Papers
Presentations will be limited to 30 minutes, inclusive of a 20–25 minute presentation followed by Q&A. The technical content should be noncommercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Authors of papers selected for the conference will receive further guidance on formatting papers and presentation slides, and instructions for registration. Conference speakers are entitled to a free one-day conference pass for the day of their presentations and are eligible for discounted rates if they wish to register themselves for the full conference. Presenters are responsible for making their own travel and hotel reservations, and are encouraged to use the discounted booking options provided by IPC.
Technical Posters
All posters will be displayed in a centrally-located area near the Technical Conference sessions, with dedicated Poster Networking Sessions for increased visibility. The technical content should be noncommercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Authors of posters selected for the conference will receive further guidance on formatting, printing, and displaying posters, and instructions for registration. Poster presenters are entitled to a free one-day conference pass for the day of their presentations and are eligible for discounted rates if they wish to register themselves for the full conference. Presenters are responsible for making their own travel and hotel reservations, and are encouraged to use the discounted booking options provided by IPC.
Professional Development Courses
Courses can be offered as one 3-hour session or two 3-hour sessions (offered as Part 1 & Part 2 for a total of 6 hours). Instructors of courses selected for the Professional Development program will receive further guidance on formatting presentation slides, as well as instructions for instructor registration. Honoraria and travel expense stipends are offered to professional development instructors. Instructors are responsible for making their own travel and hotel reservations, and are encouraged to use the discounted booking options provided by IPC.
Deadline for all abstracts: Monday, June 20, 2022
Topics for Technical Conference Papers, Technical Posters, and Professional Development Courses
Comprehensive list but does not claim to be definitive. Other appropriate topics will also be given consideration.
- 3D Printing/Additive Manufacturing
- AI-Enabled Inspection
- Artificial Intelligence / Machine Learning
- Augmented / Virtual Reality
- Automation, Robotics, Cobots
- Blockchain / Digital Supply Chain
- CAD, 3D Design
- Cloud Computing
- Connected Factory Exchange (CFX)
- Cyber-Physical Production Systems
- Cybersecurity
- Data Analytics, Big Data, Business Intelligence
- Digital Thread
- Digital Transformation Operations/Supply Chain
- Digital Twin
- Industrial Internet of Things (IIoT)
- Industrial Networks (IT/OT Convergence)
- Industry 4.0 / Smart Factory
- Simulation and Modeling
- Smart Sensor Technologies
- Advanced Packaging Heterogeneous Integration
- Battery Technologies
- Energy Harvesting
- E-textiles and Smart Textiles, Wearables
- Flexible Hybrid Electronics
- Graphene in Electronics Manufacturing
- LED Manufacturing
- MEMS
- Nanotechnology
- Optoelectronics
- Photovoltaics
- Power Electronics
- Sensors and Haptics
- Automotive
- Biotech
- Class 3+
- Harsh Environments
- Ruggedization
- Space/Avionics
- Additive, Semi-Additive Build-up Technologies
- Black Pad and Other Board Related Defects
- CAF
- HDI Technology
- High Frequency
- High Speed
- High Voltage
- IC Substrates
- Laminate Materials (Rigid, Flex)
- Microvia Design and Testing
- PCB Reliability
- PCB/Pad Repair
- Printed Electronics
- RF Materials
- Signal Integrity
- Solderability
- Surface Finishes
- Via Plugging and Other Protection
- Via Stacking
- Advanced Packaging and Components
- 2.5D/3D Component Packaging
- Connectors
- Design for Excellence (DFX)
- Design for Manufacturability (DFM)
- Design for Test (DFT)
- Die Attach
- Electro-Mechanical Design
- Embedded Technologies (die/bridge/components)
- Flexible Circuits
- 0201/01005/03015 Passives
- Package on Package
- Printed Electronics
- Re-balling Components
- RFID Circuitry
- Semiconductor
- Wire Bonding
- Accelerated Life Testing
- Automated Optical Inspection (AOI)
- Automated Solder Paste Inspection (SPI)
- Automated X-ray Inspection (AXI)
- Corrosion
- Contamination
- Electrical Testing (ICT, FCT)
- Electromigration
- ESD Protection
- Failure Analysis
- Inspection Methods
- Lean Manufacturing (Six Sigma)
- Microvia Interface Failures
- PCB Reliability
- Reliability after Repair or Rework
- Statistical Process Control
- Surface Insulation Resistance Testing
- Surface Reliability
- Test Method Developments
- Tin Whiskers
- Traceability/Counterfeit Electronics
- Advanced Packaging Component Assembly
- BTC/LGA/QFN Assembly Challenges
- Cleaning
- Coating Processes
- Electronics Manufacturing Services
- Final System Assembly / Box Build
- Mechanical Assembly
- Novel Solder Deposition Methods
- Press-fit / Compliant Pin Technology
- Preventative Maintenance
- Process Best Practices
- Reflow Ovens and Profiling
- Rework Processes
- Robotic, Laser and Selective Soldering Processes
- Second-Level Interconnect Assembly
- Stencil Printing
- Surface Mount Technology (SMT) Process
- Surface Preparation Methods
- Vapor Phase Soldering
- Warpage-induced Defect Mitigation
- Adhesives
- Alloys (Lead-Free, Tin-Lead, High Temp)
- Cleaning Chemistries
- Conformal Coatings
- High Reliability Solders
- Low Temperature Soldering (LTS)
- Material Evaluation Methods
- Next Generation Solders and Fluxes
- Sintering Materials
- Thermal Interface Materials (TIMs)
- Underfills, Edge-Bond, Corner-Bond
- Alternative Chemistries, Materials, Processes
- Corporate Sustainability Reporting
- Digital Product Passport
- Eco-design
- Emerging Policies on Sustainable Chemicals
- Environmental Electronics Leadership
- Environmental Protection and Compliance
- Materials Declarations Traceability
- Responsible Sourcing
- Responsible Supply Chain Management
- Sustainable, Safe Chemicals and Products
Conference Awards
To recognize exceptional achievement, the IPC Technical Program Committee will select top qualifying papers and one top poster for awards. Awards include “Best of Conference,” “NextGen Best Paper,” “Best Student Research Paper,” and “Best Technical Poster.” To qualify, all paper, poster, and presentation deadlines must be met. Each award consists of a recognition plaque for each author and an honorarium.
Non-Commercialism Policy and Original Work
All authors and instructors will be asked to agree to IPC’s Non-Commercialism Policy. Previously published papers and/or commercially focused papers, posters, and presentations will not be accepted. This applies to oral presentations, text, and figures (presentation slides, papers, and posters).
Download our Non-Commercialism Policy
Questions
For more information about participating at IPC APEX EXPO as a technical conference presenter or professional development course instructor, please contact IPC’s Professional Development and Events Manager, Julia Gumminger, by email at CallForParticipation@ipc.org.
Submission and Timeline
Monday, June 20, 2022
- Abstracts for Technical Papers, Posters, and Professional Development Courses due
Monday, July 25, 2022
- Approved Technical Paper & Poster authors invited to submit
- Approved Professional Development Course instructors invited to submit course plans
Monday, September 19, 2022
- Invited Technical Papers, Posters & Professional Development Course Plans Due
Monday, October 24, 2022
- Accepted Technical Papers, Posters, and Professional Development Courses announced to authors/instructors with any requests for edits
Monday, November 21, 2022
- Technical Paper and Professional Development Course presentation slides due
- Final Technical Posters Due
Friday, December 16, 2022
- Deadline for presenters and instructors to register for IPC APEX EXPO 2023