Call for Participation

IPC has extended the deadline for abstracts and course proposals to Monday, August 31. Due to travel restrictions by some companies and geopolitical areas, we are also accepting proposals for virtual presentations.

Submit an abstract for one of the industry's premier technical conferences or provide a course proposal for one of its largest educational events. Presenting at IPC APEX EXPO 2021 in San Diego will provide significant visibility for you and your company. Thousands of individuals will receive the technical proceedings of the conference, ensuring that your published paper will be seen by key engineers, managers and executives from all segments of the worldwide electronic interconnection industry. Presenting a technical conference paper or teaching a professional development course is a unique and cost-effective channel to promote your expertise and your organization to your customers, prospects and the industry.

TOPICS for Technical Conference Papers and Professional Development Courses

Factory of the Future Implementation

  • 3D Printing/Additive Manufacturing in Electronics
  • 4D Smart Material Printing
  • AI-Enabled Inspection
  • Artificial Intelligence (AI)/Machine Learning
  • Augmented Reality/Virtual Reality
  • Automation
  • Blockchain
  • Connected Factory Exchange (CFX)
  • Cybersecurity
  • Data Analytics/Big Data/Business Intelligence (BI)
  • Digital Transformation of Operations and Supply Chain
  • Digital Twin/Digital Thread
  • Industrial Internet of Things (IIoT)
  • Industrial Networks (IT/OT Convergence)
  • Industry 4.0
  • Robotics/Cobots
  • Simulation and Modeling
  • Smart Factory
  • Smart Sensor/Actuator Technologies
  • Systems Integration

Circuit Design and Component Technologies

  • Design for Excellence (DFX)
  • Design for Manufacturability (DFM)
  • Design for Test (DFT)
  • Embedded Passive and Active Devices
    • CAD Design Tools
  • Printed Electronics
  • Flexible Circuits
  • RFID Circuitry
  • 2.5-D/3-D Component Packaging
  • Package on Package
  • Flip Chip/0201 Metric
  • Re-balling Components
  • Connectors
  • Die attach
  • Semiconductor
  • Wire Bonding
    • Ultra-thin die assembly
  • BGA Packaging

    Quality, Reliability, Test and Inspection

    • Accelerated Life Testing
    • Automated Inspection (SPI, AOI, AXI)
      • Solder Paste Inspection (SPI)
      • Automated Optical Inspection (AOI)
      • Automated X-ray Inspection (AXI)
    • Failure Analysis
    • In-circuit Testing (ICT)
    • Inspection Methods
    • Microvia Interface Failures
    • Process Control
    • Reliability after Repair or Rework
    • Surface Reliability
      • Corrosion
      • Electromigration
      • Objective Evidence
      • Surface Insulation Resistance Testing (SIR)
    • Test Method Developments
    • Tin Whiskers

        Enabling Future Technologies

        • Microminiaturization 
        • Nanotechnology 
        • E-textiles and Smart Textiles
        • Energy Harvesting
        • Flexible Hybrid Electronics
        • Graphene in Electronics Manufacturing
        • LED Manufacturing
        • Optoelectronics
        • Photovoltaics
        • Sensors and Haptics
        • Wearables

        Meeting Extreme Requirements

        • Automotive
        • Biotech
        • Class 3+
        • Harsh Environments
        • Power Electronics
          • Battery technologies
        • Ruggedization
        • Space/Avionics

        Electronics Materials

        • Adhesives
        • Conformal Coatings
        • High Temperature Alloys
        • Material Evaluation Methods
        • Pb-free Alloys
          • Low temperature soldering 
        • Sintering Materials
        • Thermal Interface Materials (TIMs)
        • Underfills

        Conscientious Engineering

        • Electronic Documentation
        • Environmental Protection and Compliance
        • ESD Protection
        • Industry Roadmaps
        • Leadership Strategies
        • Lean Manufacturing (Six Sigma)
        • Onshoring/Reshoring
        • PCB and Component Storage and Handling
        • Preventative Maintenance
        • Problem Solving/Design of Experiments/Root Cause Analysis
        • Sustainability
        • Supply Chain Management
        • Traceability/Counterfeit Electronics

          Assembly Processes

          • BTC/LGA/QFN Assembly Challenges
          • Cleaning
          • Coating Processes
          • Electronics Manufacturing Services
          • Novel Solder Deposition Methods
          • Process Best Practices
          • Reflow Ovens and Profiling
          • Rework Process
          • Robotic, Laser and Selective Soldering Processes
          • Stencil Printing
          • Surface Preparation Methods
          • Surface Mount Technology (SMT) Process
          • Vapor Phase
          • Warpage-induced Defect Mitigation

              PCB Fabrication and Materials

              • 5G
              • Additive and Semi-Additive Processes
              • Black Pad and Other Board Related Defects
              • CAF
              • HDI Technology
              • High Frequency
              • High Speed
              • High Voltage (for Automotive Applications)
              • Microvia Design and Testing
              • PCB/Pad Repair
              • RF Materials
              • Signal Integrity 
              • Solderability
              • Surface Finishes
              • Via Plugging and Other Protection

                  Technical Conference

                  Requirements for Submission

                  Provide an abstract of approximately 300 words that summarizes technical work, covering case histories, research and discoveries. Authors of papers selected for the conference will each receive a detailed speaker manual to assist them with numerous items, including the formatting of their papers and presentation slides.

                  The selection process is competitive and sufficient detail needs to be included to allow the Technical Program Committee to properly assess content of the proposed paper. The paper should be noncommercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Presentations will be limited to 30 minutes, which includes approximately 5 minutes for questions and answers.

                  Conference Benefits

                  Conference speakers are entitled to a free one-day conference pass for the day of their presentations, discounted registration fees for the full conference and complimentary admission to the exhibit hall.

                  All speakers selected for papers who provide both their paper and presentation to IPC by October 28, 2020 will be eligible for a free full-conference pass. IPC leaves it to the primary and co-authors’ discretion on how the honorarium should be distributed.

                  Conference Awards

                  To recognize exceptional achievement, awards will be presented for "Best Paper." Each award consists of a recognition plaque for each author and a $1,000 prize.

                  Please Note

                  Previously published papers and/or commercially focused papers are not appropriate and will not be accepted.

                  Conference Paper Timeline

                  • Abstracts due August 31, 2020
                  • Acceptance/status of your submittal by September 30, 2020
                  • Papers are due November 11, 2020
                  • Presentations are due December 9, 2020

                  For more information about conference participation, please contact Toya Richardson at or +1 847-597-2825.

                  Professional Development Courses

                  Course proposals are solicited from individuals interested in teaching half-day (three-hour) professional development courses on design, manufacturing processes and materials. Travel expenses and honorariums are offered to professional development instructors.

                  Professional Development Timeline

                  • Proposals due August 31, 2020
                  • Acceptance by September 30, 2020
                  • Final presentation revisions due December 17, 2020.

                  For more information about professional development, please contact Andrea Keefe at or +1 847-597-2879.

                  Abstract and Proposal Instructions

                  Submit your Technical Paper Abstract or Professional Development Course Proposal online.