Technical Conference
The Electronic Circuits World Convention (ECWC 16) Technical Conference at IPC APEX EXPO 2024 promises to showcase the latest original technical data from the world’s leaders in electronics manufacturing research. The Technical Conference paper presentations will cover the newest and unpublished results, techniques, materials, processes, and trends. IPC APEX EXPO 2024 is proud to host ECWC16, where presenters and attendees will address the biggest issues facing the $2 trillion global electronics industry including boosting operational efficiency, improving product quality and reliability, innovations in advanced HDI and PCB HDI technologies, and outlook for Factory of the Future trends.
Two Hot-Topic Special Sessions on Thursday
- Insights on NextGen Packaging: Needs for uHDI and IC Substrates
- EV Electronics: Design, Manufacturing, and Reliability Challenges
Learn More
Choose Sessions from Nine Hot-Topic Tracks:
- Design
- PCB Fabrication and Materials
- Assembly Materials
- Assembly Processes
- HDI, uHDI, and Substrates
- Sustainability for Electronics
- High Reliability
- Factory of the Future
- Quality, Reliability, Test, and Inspection
Schedule subject to change.
Denotes sustainability topic.
Presentation: Latest PCIe Generation PCB Design and simulations: Overcoming Design, Cost, Yield, Technology Tradeoffs
Speaker: Savita Ganjigatti | Vice President, SiennaECAD
Presentation: Impact of CPU Pin Pattern Orientation to High-Speed Interconnect Data Center Board Designs With Intensive Correlation of Signal Integrity and Electrical Validation
Speaker: Jimmy Hsu | Principal Engineer, Intel Corporation
Presentation: Technical Research for PCB Design Solution of High Efficiency Thermal Dissipation
Speaker: Meijuan Sarah Kuang | Tech Support Manager, Kinwong Electronic Technology (Longchuan) Co., Ltd.
Presentation: Innovative Hybrid Solder Mask for Coupling Reduction in High-Speed Application
Speaker: Jimmy Hsu | Principal Engineer, Intel Corporation
Tuesday, April 9 | 10:00 AM-12:00 PM
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Savita Ganjigatti | Vice President, SiennaECAD |
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Jimmy Hsu | Principal Engineer, Intel Corporation |
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Meijuan Sarah Kuang | Tech Support Manager, Kinwong Electronic Technology (Longchuan) Co., Ltd. |
Presentation: The Improvement of Warp in Rigid-Flex Board
Speaker: Zhu Guangyuan | Senior Engineer, SHENGYI ELECTRONICS CO., LTD.
Presentation: Asymmetric Hybrid Printed Circuit Board Design and Flexibility Study for High-speed Data Center Platforms
Speakers: Kaspar Tsang | Senior Development Manager of Infrastructure Solutions Group, Lenovo
Presentation: Study on the Influencing Factors of Interlayer Reliability of Rigid-Flex Board with Multiple Air-Gap
Speaker: Zhu Guangyuan | Senior Engineer, SHENGYI ELECTRONICS CO., LTD.
Presentation: The Study of Resin Flow Indentation for Rigid-Flex PCB
Speaker: Yao Yonggan | Chief engineer, SHENGYI ELECTRONICS CO., LTD.
Tuesday, April 9 | 10:00 AM-12:00 PM
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Zhu Guangyuan | Senior Engineer, SHENGYI ELECTRONICS CO., LTD. |
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Kaspar Tsang | Senior Development Manager of Infrastructure Solutions Group, Lenovo |
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Yao Yonggan | Chief engineer, SHENGYI ELECTRONICS CO., LTD. |
Presentation: Innerlayer Copper Balancing to Reduce PCB Surface Topography Under Large Form Factor BGAs
Speaker: Gary Brist | Principal Engineer PCB Applications, Intel Corporation and HDP User Group
Presentation: HDP Users Group Thermal Analysis Methodology Assessment
Speaker: Tony Senese | Manager, R&D and Business Development, NA, Panasonic
Presentation: Crack Formation in Glass Fiber Reinforced Polymer Printed Circuit Boards after Thermal Storage
Speaker: Mandy Krott | Engineering Assembly and Interconnect Technology, Bosch and PhD Student, Robert Bosch GmbH
Tuesday, April 9 | 1:30 PM-3:00 PM
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Gary Brist | Principal Engineer PCB Applications, Intel Corporation and HDP User Group |
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Tony Senese | Manager, R&D and Business Development, NA, Panasonic |
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Mandy Krott | Engineering Assembly and Interconnect Technology, Bosch and PhD Student, Robert Bosch GmbH |
Presentation: Managing Backdrill Stub Length Variations due to Innerlayer Core Deformation
Speaker: Gary Brist | Principal Engineer PCB Applications, Intel Corporation and HDP User Group
Presentation: Research on High-Speed Material Insertion Loss in Server Platform
Speaker: CanJun Xiang | Senior Engineer, Delton Technology(GuangZhou) Inc.
Presentation: Tuning the Dielectric Constant (Dk) of Electronic Materials to Meet the Demands of Any Application
Speaker: Kevin Bivona | R&D Lab Manager, AGC Multi Material America
Tuesday, April 9 | 3:30 PM-5:00 PM
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Gary Brist | Principal Engineer PCB Applications, Intel Corporation and HDP User Group |
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CanJun Xiang | Senior Engineer, Delton Technology (GuangZhou) Inc. |
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Kevin Bivona | R&D Lab Manager, AGC Multi Material America |
Presentation: The Formulating Technology of Extremely Low Loss PCB Material for 112/224 Gbps Without Sacrificing Reliability
Speaker: Tomoaki Nakanishi | Scientist, AGC Multi Material America
Presentation: The Impact of Final Finishes and Thermal Aging on Insertion Loss at Frequencies Up to 150 GHz
Speaker: Britta Schafsteller, Ph.D. | Global Product Manager, MKS Instrumentsnts
Presentation: High-frequency Signal Characteristics of Differential Striplines with Different Cu-Foil Roughness
Speaker: Eillie Chiang | Master's Degree Student, Yuan Ze University
Presentation: The Surface Treatment for Semiconductor Substrate Using Low-Temperature Synthesis of Few Layer Graphene
Speaker: Min Park, Ph.D. | Senior Researcher, Haesung DS
Wednesday, April 10 | 8:00 AM-10:00 AM
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Tomoaki Nakanishi | Scientist, AGC Multi Material America |
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Britta Schafsteller, Ph.D. | Global Product Manager, MKS Instrumentsnts |
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Eillie Chiang | Master's Degree Student, Yuan Ze University |
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Min Park, Ph.D. | Senior Researcher, Haesung DS |
Presentation: Advancing Copper Electroplating Processes: Innovative Solutions for Excellent Via Fill and V-Pit Resistance
Speaker: Saminda Dharmarathna, Ph.D. | Principal Research Scientist, MacDermid Alpha Electronics Solutions
Presentation: A Novel Ni Free Surface Finish Capable of Resisting Copper Creep Corrosion for Better Solder Joint Reliability and Signal Integrity of Printed Circuit Boards (PCBs)
Speaker: Kunal Shah, Ph.D. | President, LILOTREE
Presentation: High Speed Material Asymmetric Mixed Pressure Warping Analysis of Server Motherboard
Speaker: Zhi Chao Zhang | Senior Engineer, Delton Technology (Guang Zhou), Inc.
Wednesday, April 10 | 10:30 AM-12:00 PM
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Dr. Saminda Dharmarathna | Principal Research Scientist, MacDermid Alpha Electronics Solutions |
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Kunal Shah, Ph.D. | President, LILOTREE |
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Zhi Chao Zhang | Senior engineer, Delton Technology (Guang Zhou), Inc. |
Presentation: A Study of the Impacts of Physical Parameters on Electrolytic Panel Plating
Speaker: Rick Nichols | Technical Marketing Director, Greensource
Presentation: Study on Carbon Removal of Shadow Residue from Flexible Plate Surface in Rigid-Flex PCB
Speaker: Peng Wang | Product Development Engineer, Shennan Circuits Co., Ltd
Presentation: Study of Hole Wall Cracking Defects in Power Module Heavy Copper Printed Circuit Boards
Speaker: Sun Fu | Technology Development Manager, Founder PCB
Wednesday, April 10 | 1:30 PM-3:00 PM
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Rick Nichols | Technical Marketing Director, Greensource |
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Peng Wang | Product Development Engineer, Shennan Circuits Co., Ltd |
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Sun Fu | Technology Development Manager, Founder PCB |
Presentation: Next Generation Reduction Assisted Immersion Gold
Speaker: Colin Poedtke | Technical Service Engineer, Uyemura International Corporation
Presentation: Achieving a Successful ENEPIG Finished PCB Under Revision A of IPC 4556
Speaker: Michael Orsini | Application Chemist, MacDermid Alpha Electronics Solutions
Presentation: Acid Copper Plating Additive Improving Flexibility of Wiring Design for High Current Density
Speaker: Junji Yoshikawa | Manager, OKUNO CHEMICAL INDUSTRIES CO.,LTD
Wednesday, April 10 | 3:30 PM-5:00 PM
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Colin Poedtke | Technical Service Engineer, Uyemura International Corporation |
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Michael Orsini | Application Chemist, MacDermid Alpha Electronics Solutions |
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Junji Yoshikawa | Manager, OKUNO CHEMICAL INDUSTRIES CO.,LTD |
Presentation: Development and Enhancement of Low Temperature Soldering Solution for SMT
Speaker: Ukai Ryuji | Researcher, Senju Metal Industry Co., LTD
Presentation: The Attempt of Lower Temperature Soldering Process for Large Plastic Ball-Grid Array Board-Level Assembly
Speaker: Hongwen Zhang, Ph.D. | Principal Research Metallurgist, R&D Manager of Alloy Group, Indium Corporation
Presentation: Advancing the Understanding of Low-Temperature Solder in Electronics Rework and Assembly
Speakers: Timothy O'Neill | Director of Product Management, AIM Solder and Gayle Towell | Content Marketing Specialist, AIM Solder
Wednesday, April 10 | 1:30 PM-3:00 PM
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Ukai Ryuji | Researcher, Senju Metal Industry Co., LTD |
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Hongwen Zhang, Ph.D. | Principal Research Metallurgist, RnD Manager of Alloy Group, Indium Corporation |
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Timothy O'Neill | Director of Product Management, AIM Solde |
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Gayle Towell | Content Marketing Specialist, AIM Solder |
Presentation: Development and Enhancement for Low Temperature Wave Soldering Solution
Speaker: Takahiro Matsufuji | Researcher, Senju Metal Industry Co., LTD
Presentation: Advanced Heat Removal, an Electronics Overmolding Advantage
Speaker: Troy Diaz | Lead Mechanical Engineer, X2F
Presentation: Fill the Void VII: A Continuing Study of the Impact of Solder Alloy on Voiding in Solder Joints
Speaker: Tony Lentz | Chemist & Field Application, FCT Solder
Wednesday, April 10 | 3:30 PM-5:00 PM
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Takahiro Matsufuji | Researcher, Senju Metal Industry Co., LTD |
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Troy Diaz | Lead Mechanical Engineer, X2F |
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Tony Lentz | Chemist & Field Application, FCT Solder |
Presentation: Strategies for Enhanced Reliability in the Cleaning of Vented Components
Speaker: Ram Wissel | Vice President of Global Technology, KYZEN Corporation
Presentation: Technical Cleanliness of FR4 Substrates and its Influence Factors for Laser Depaneling
Speaker: Patrick Stockbruegger | Product Manager, LPKF Laser & Electronics SE
Presentation: Sealed Versus Exposed Atmosphere Solder Printing Comparison for Type-6 Powder Solder Paste
Speaker: Edward Nauss | Sr. Applications Engineer, ITW/EAE
Presentation: Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes for Complex Electronics Assemblies
Speakers: Kalyan Nukala | Application Engineer, ZESTRON Americas and Evan Griffith | Product Specialist, Indium
Wednesday, April 10 | 8:00 AM-10:00 AM
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Ram Wissel | Vice President of Global Technology, KYZEN Corporation |
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Patrick Stockbruegger | Product Manager, LPKF Laser & Electronics SE |
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Edward Nauss | Sr. Applications Engineer, ITW/EAE |
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Kalyan Nukala | Application Engineer, ZESTRON Americas |
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Evan Griffith | | Product Specialist, Indium |
Presentation: Optimizing Performance and Reliability: Key Factors for Cleaning in Immersion-Cooling Applications
Speaker: Adam Klett, Ph.D. | Director of Science, KYZEN Corporation
Presentation: Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing
Speakers: Sunny Agarwal | Sr. Applications Engineer, ITWEAE and Miloš Lazić | Product Development Specialist, Indium Corporation
Presentation: Reflow Soldering of PCB Components With Mixed Thermal Mass
Speaker: Gerjan Diepstraten | Advanced Technology Manager, ITWEAE
Wednesday, April 10 | 10:30 AM-12:00 PM
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Adam Klett, Ph.D. | Director of Science, KYZEN Corporation |
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Sunny Agarwal | Sr. Applications Engineer, ITWEAE |
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Miloš Lazić | Product Development Specialist, Indium Corporation |
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Gerjan Diepstraten | Advanced Technology Manager, ITWEAE |
Presentation: Process Challenges for Selective Soldering: Examining Parameters for Optimal Processing
Speaker: Samuel J. McMaster, Ph.D. | Research & Development Specialist, Pillarhouse International, Coventry University
Presentation: Optimization of Photonic Soldering Processes for SIR Performance
Speaker: Ara Parsekian, Ph.D. | Senior Applications Engineer, PulseForge, Inc.
Presentation: iNEMI 2023 Board Assembly-CPU Socket Interposer Technology Roadmap
Speaker: Paul Wang, PhD, MBA | VP of Global Quality and Technology Engineering, Tyan Computer (a MiTAC company)
Wednesday, April 10 | 3:30 PM-5:00 PM
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Samuel J. McMaster, Ph.D. | Research & Development Specialist, Pillarhouse International, Coventry University |
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Ara Parsekian, Ph.D. | Senior Applications Engineer, PulseForge, Inc. |
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Paul Wang, PhD, MBA | VP of Global Quality and Technology Engineering, Tyan Computer (a MiTAC company) |
Presentation: Advanced Ferric Sulfate Differential Etching: Meeting the Challenges of Electronics Miniaturization
Speaker: Manuel Christopher Galvez | Product Marketing Manager, MKS Instruments, Inc.
Presentation: Vacuum Etch Technology for Fine Line Width and Space in PCBs
Speaker: Reginald Lai | Packaging R&D Engineer, Intel Corporation
Presentation: Maximize Throughput with Innovative Laser/optics Configuration, Precision Pulse Shaping, and Steering Designed for ABF Materials
Speaker: Kyle Baker | Product Marketing Specialist, MKS Instruments, Inc.
Wednesday, April 10 | 10:30 AM-12:00 PM
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Manuel Christopher Galvez | Product Marketing Manager, MKS Instruments, Inc. |
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Reginald Lai | Packaging R&D Engineer, Intel Corporation |
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Kyle Baker | Product Marketing Specialist, MKS Instruments, Inc. |
Presentation: Optimizing the Interconnect: Laser Drilling and Plating Chemistry Synergies for Via Formation
Speaker: Chris Ryder | Director of Business Development, MKS Instruments, Inc.
Presentation: CO2 Laser-Direct Drilling of Blind Via in Brown Oxidized Copper Clad Laminate
Speaker: Xin Huang, Ph.D. | Manager, DELTON TECHNOLOGY (GUANGZHOU)INC.
Presentation: New Solutions for Inclusion-Free Copper Filling of Through Vias for Latest Generation Substrate Designs
Speaker: Henning Hübner | Global Product Manager PP, MKS Atotech
Wednesday, April 10 | 1:30 PM-3:00 PM
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Chris Ryder | Director of Business Development, MKS Instruments, Inc. |
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Xin Huang, Ph.D. | Manager, DELTON TECHNOLOGY (GUANGZHOU)INC. |
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Henning Hübner | Global Product Manager PP, MKS Atotech |
Presentation: Microvia Fatigue Life Design Study Findings to Mitigate Functional Failures
Speaker: Enold Pierre-Louis | Technical Fellow, The Aerospace Corporation
Presentation: Microvia Reliability Using a Simple Test Vehicle
Speaker: Caleb Ancharski | Research Chemist, AGC
Presentation: Stacked Microvia Reliability and Test Methodology Evaluation
Speaker: Todd Harris | Packaging R&D Engineer, Intel
Presentation: Research on Electroplating Capability of Multi-Layer Interconnected Deep Microvia PCB Based on Simulation Model
Speakers: Kanglei Wang | Senior Engineer, Shennan Circuit Co., Ltd and Sean Shi | Senior Product Specialist, Shennan Circuit Co., Ltd
Wednesday, April 10 | 3:30 PM-5:30 PM
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Enold Pierre-Louis | Technical Fellow, The Aerospace Corporation |
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Todd Harris | Packaging R&D Engineer, Intel |
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Caleb Ancharski | Research Chemist, AGC |
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Kanglei Wang | Senior Engineer, Shennan Circuit Co., Ltd |
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Sean Shi | Senior Product Specialist, Shennan Circuit Co., Ltd |
Presentation: Research on the Performance and Recycling of a Novel Halogen-free Degradable Copper Clad Laminate
Speakers: Scarlet Yi Wang | Technical Marketing Director, Shengyi Technology Co., LTD. and Fortune Xiao | Technical Marketing Project Manager, Shengyi Technology Co., LTD.
Presentation: High Sustainable Content PC/ABS with Improved Environmental Stress Cracking Resistance
Speaker: Yuntao Li, Ph.D. | Lead Scientist, SABIC
Presentation: Can Assembly Materials Help You Achieve Your Sustainability Objectives?
Speaker: Jennifer Fijalkowski | Sustainability & Product Specialist, MacDermid Alpha Electronic Solutions
Presentation: Innovative Low-Temperature Solder Alloy & Optimized Convection Reflow Oven Combination to Achieve Up to 25% Energy Savings
Speaker: Andreas Karch | Technical Manager/Technologist – Advanced Applications, Indium Corporation and Daniel Hamann | Sales Manager Europe and Key Accounts, SMT Thermal Discoveries
Tuesday, April 9 | 10:00 AM-12:00 PM
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Scarlet Yi Wang | Technical Marketing Director, Shengyi Technology Co., LTD. |
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Fortune Xiao | Technical Marketing Project Manager, Shengyi Technology Co., LTD. |
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Yuntao Li, Ph.D. | Lead Scientist, SABIC |
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Jennifer Fijalkowski | Sustainability & Product Specialist, MacDermid Alpha Electronic Solutions |
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Andreas Karch | Technical Manager/Technologist – Advanced Applications, Indium Corporation |
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Daniel Hamann | Sales Manager Europe and Key Accounts, SMT Thermal Discoveries |
Presentation: Sustainable Smart Surfaces
Speaker: Outi Rusanen, Ph.D. | Principal Interconnection Specialist, TactoTek
Presentation: A Parametric Approach to Quantifying the Environmental Impact of PCB Manufacturing
Speaker: Maarten Cauwe, Ph.D. | R&D Team Leader, imec
Tuesday, April 9 | 3:30 PM-5:00 PM
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Outi Rusanen, Ph.D. | Principal Interconnection Specialist, TactoTek |
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Maarten Cauwe, Ph.D. | R&D Team Leader, imec |
Presentation: Humidity Robustness of Electronic Control Units – The Hidden Factor Solder Resist
Speaker: Lothar Henneken, Ph.D. | Senior Expert, Robert Bosch GmbH
Presentation: Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle
Speaker: Thomas E. Sanders, Ph.D. | Parts Failure Engineer, Jet Propulsion Laboratory
Presentation: QFN Assembly Reliability Under a New HALT Test Method
Speaker: Reza Ghaffarian, Ph.D. | Principal Engineer, Jet Propulsion Laboratory/NASA
Tuesday, April 9 | 1:30 PM-3:00 PM
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Lothar Henneken, Ph.D. | Senior Expert, Robert Bosch GmbH |
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Thomas E. Sanders, Ph.D. | Parts Failure Engineer, Jet Propulsion Laboratory |
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Reza Ghaffarian, Ph.D. | Principal Engineer, Jet Propulsion Laboratory/NASA |
Presentation: How Artificial Intelligence (AI) Helps on Automated X-ray Inspection (AXI) Process
Speaker: Wei Ken Hee | Sr. Product Marketing Engineer, Vitrox Technologies Sdn Bhd
Presentation: Automatic Measurement Method for Solder Void Ratio and Solder Coverage Using Deep Neural Networks
Speaker: Ryusuke Ueki | Leader of the AI Research Lab, Qualtec Co., Ltd.
Presentation: Machine-Learning Based Solderability Check of THT Solder Joints
Speaker: Reinhardt Seidel, Ph.D. | Research Assistant, Friedrich-Alexander-Universität Erlangen-Nürnberg, Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)
Tuesday, April 9 | 10:00 AM-12:00 PM
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Wei Ken Hee | Sr. Product Marketing Engineer, Vitrox Technologies Sdn Bhd |
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Ryusuke Ueki | Leader of the AI Research Lab, Qualtec Co., Ltd. |
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Reinhardt Seidel, Ph.D. | Research Assistant, Friedrich-Alexander-Universität Erlangen-Nürnberg, Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) |
Presentation: Implementation of 3D Printed Near Chip-Scale Interposers into X-Band Dual Channel MMIC Assembly
Speaker: Emily Lamport | Ph.D. Student, University of Massachusetts Lowell
Presentation: On-Demand Manufacture of Small Satellites through Advancements in Direct Digital Manufacturing
Speaker: Jason C Benoit | Mechanical Engineer, Sciperio
Presentation: Liquid Metal Patterning for Electronic Circuits and Thermal Management
Speaker: Michael Dickey, Ph.D. | Camille and Henry Dreyfus Professor in the Department of Chemical & Biomolecular Engineering, NC State University
Presentation: Reliability Validation of Direct-Write Printed RF Devices
Speaker: Tom Rovere | Research Scientist, Associate Fellow, Lockheed Martin
Wednesday, April 10 | 8:00 AM-10:00 AM
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Emily Lamport | Ph.D. Student, University of Massachusetts Lowell |
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Jason C Benoit | Mechanical Engineer, Sciperio |
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Michael Dickey, Ph.D. | Camille and Henry Dreyfus Professor in the Department of Chemical & Biomolecular Engineering, NC State University |
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Tom Rovere | Research Scientist, Associate Fellow, Lockheed Martin |
Presentation: Factory of the Future - Automating Simulation Creation as Part of a Digital Twin Initiative
Speaker: Craig Dickson | Engineering Manager, Flex Ltd
Presentation: Applying Hierarchical Machine Learning Forecast to Manufacturing Process Sequences
Speaker: Mohan Rangan Govindaraj | R&D Manager, Siemens EDA
Presentation: Achieving Equipment Orchestration Through Equipment Integration
Speaker: Yu Xian Ang | Team Leader, camLine Sdn. Bhd. Shi
Wednesday, April 10 | 1:30 PM-3:00 PM
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Craig Dickson | Engineering Manager, Flex Ltd |
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Mohan Rangan Govindaraj | R&D Manager, Siemens EDA |
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Yu Xian Ang | Team Leader, camLine Sdn. Bhd. Shi |
Presentation: Automatic Testing of High-Speed I/O in Manufacturing
Speaker: Louis Ungar | President, A.T.E. Solutions, Inc.
Presentation: Modular RF Test Enclosure / Test Fixture Combinations: Design, Innovations and Characterization
Speaker: Matthias Zapatka, Ph.D. | CTO+FAE, INGUN USA, Inc.
Presentation: Statistical Analysis of Full-scope In-board Electrical Characterization for Partial Plane-on-Outer-Layer Design Evaluation
Speaker: Jimmy Hsu | Principal Engineer, Intel Microelectronics Asia LLC
Tuesday, April 9 | 1:30 PM-3:00 PM
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Louis Ungar | President, A.T.E. Solutions, Inc. |
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Matthias Zapatka, Ph.D. | CTO+FAE, INGUN USA, Inc. |
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Jimmy Hsu | Principal Engineer, Intel Microelectronics Asia LLC |
Presentation: Monotonic Bend Characterization of Board-Level Solder Interconnects with Finite Element Analyses
Speaker: Marius Tarnovetchi | Senior Expert, VItesco Technologies
Presentation: Tracking Voiding and Solder Coverage of SMT Solder Joints by Automated X-Ray Inspection - A Revealing Round Robin Study
Speaker: Norbert Holle, Ph.D. | Development Engineer, Robert Bosch GmbH
Presentation: Evaluation of Surface Roughness of Copper Foils for 5G Applications Using Novel mmWave Resonators
Speaker: Malgorzata Celuch, Ph.D. | President, QWED Sp. z o. o.; Warsaw University of Technology
Tuesday, April 9 | 3:30 PM-5:00 PM
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Marius Tarnovetchi | Senior Expert, VItesco Technologies |
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Norbert Holle, Ph.D. | Development Engineer, Robert Bosch GmbH |
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Malgorzata Celuch, Ph.D. | President, QWED Sp. z o. o.; Warsaw University of Technology |
Presentation: Substrate Warpage Incurred from Panel Grab at PCB Manufacturing
Speaker: Zook Kim | Package Solution Team, Samsung Electro-Mechanics
Presentation: Does Functional Circuitry Drift as Leakage Currents Form?
Speakers: Mike Bixenman, Ph.D. | Vice President/CTO, Magnalytix and Terry Munson | President, Foresite
Presentation: Research on High Potential Capability of Energy PCB
Speaker: Fanhong FH Wannianhong | R&D Manager, ASK
Presentation: Investigation of Factors Influencing SR/Cu Interface Adhesion
Speaker: Hanui Kim, Ph.D. | Senior Engineer, Samsung Electro-Mechanics
Wednesday, April 10 | 8:00 AM-10:00 AM
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Zook Kim | Package Solution Team, Samsung Electro-Mechanics |
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Dr. Mike Bixenman | Vice President/CTO, Magnalytix |
Terry Munson | President, Foresite |
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Fanhong FH Wannianhong | R&D Manager, ASK |
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Hanui Kim, Ph.D. | Senior Engineer, Samsung Electro-Mechanics |
Presentation: Robust Quality Assurance Methodology for High-speed Channel Electrical Characterization
Speakers: Yang-Hung Cheng | Section Manager, MPI Corporation
Presentation: Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for Passive Thermal Management Applications
Speakers: Matt Gallaugher, Ph.D. | Material Science Engineer, Momentive Technologies
Presentation: Experimental Verification of Optimized Signal Integrity Test Coupon to Achieve Accurate Measurement for 112-Gbps/PAM-4 Printed Circuit Board
Speaker: KyoungSoo Kim | Signal Integrity Engineer, ISU Petasys
Wednesday, April 10 | 10:30 AM-12:00 PM
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Yang-Hung Cheng | Section Manager, MPI Corporation |
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Matt Gallaugher, Ph.D. | Material Science Engineer, Momentive Technologies |
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KyoungSoo Kim | Signal Integrity Engineer, ISU Petasys |
Single Session Pass
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