Event Sponsors, Committee Members & Media Supporters

Event Sponsors

   
Event Supporting Sponsor
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ANDA
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ZESTRON
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KYZEN
   

IPC APEX Trade Show Subcommittee

Chairman, Mark Ogden, ASM Assembly Systems
Jason Spera, Aegis Industrial Software Corporation
Chip King, Fuji America Corporation
Brent Fischthal, Koh Young Technology Inc.
Paul Keehn, Kulicke & Soffa
John Perrotta, Europlacer North America
Marc Peo, Heller Industries
Brian Duffey, Mycronic Inc.
Shawn E. Robinson, Panasonic Factory Solutions Company of America
Carsten Salewski, Viscom Incorporated
Matt Wyglensowski, Yamaha Motor IM America Inc.

IPC EXPO Trade Show Subcommittee

Chairman, Kurt Palmer, Burkle North America
Joe Clure, Kurtz Ersa Inc.
John Lee, Insulectro
Rick Lies, Chemcut Corporation
John Fix, Taiyo America, Inc.
Mark Eonta, Uyemura International Corporation

Media Supporters

Adhesives & Sealants Industry
ASSEMBLY Magazine
eBOM
EDACafe
EPP Europe
Circuits Assembly
Electronics Sourcing North America (ESNA)
Global SMT & Packaging
i4.0 Today
​​​​​​​Informa Manufacturing Europe Limited
Manufacturing Technology Insights
PCB007
PCB Design007
Power Electronics World
Printed Circuit Design & Fab Magazine
Scoop Communications
Signal Integrity Journal
Silicon Semiconductor
SMTconnect
SMT Today
SMT007
SMTnet
U.S. Tech
Wiring Harness News
WNIE (What's New in Electronics)

Supporting Associations

AIM Global, Inc.
Automotive Industry Action Group (AIAG)
China Printed Circuit Association (CPCA)
European Institute of Printed Circuits (EIPC)
Hong Kong Printed Circuit Association (HKPCA)
Korea Printed Circuit Asssociation (KPCA)
MicroElectronics Packaging and Test Engineering Council (MEPTEC)
Mesago Messe Frankfurt Group
Taiwan Printed Circuit Association (TPCA)