Advanced Packaging Technical Conference Special Session

Thursday, January 26
8:00 AM-10:00 AM

Panel Speakers

Led by IPC’s Chief Technologist, Matt Kelly, the Advanced Packaging special session will provide latest insights on IC-substrate and packaging needs from industry experts.

The electronics industry is in the early stages of a new era, with unprecedented change already in motion. In this era of ‘Heterogeneous Integration’ led by massive changes in semiconductor and advanced packaging sectors, the days of following Moore’s Law are over! These fundamental changes in the semiconductor sector have significant impact throughout the rest of the electronics supply chain. As lines blur between IC-Substrate and HDI printed circuit board technologies and capabilities, the lines between OSAT and EMS manufactures also blur. Please join us for this important Advanced Packaging Special Session focused on IC-Substrates and packaging assembly.

The session will be interactive with panelists providing top of mind priorities, followed by a panel discussion with interaction from attendees. HDI and ultra HDI PCB needs along with IC-substrate and package assembly design, material, equipment, and process needs will be discussed.

e-Mobility/EV Automotive Technical Conference Special Session

Thursday, January 26
10:00 AM-1:00 PM  


Co-chairs for the Technical Program Committee special sessions are Brian O’Leary, global head of e-mobility and infrastructure at Indium, and Jason Schwartz, business development manager at KYZEN. “The first part of the agenda will address the problems and challenges, with the second part addressing the solutions,” says O’Leary. “Our speakers will share a macro perspective about supply chain issues; a policy perspective about new government regulations and incentives; and a few technical perspectives from Tier 1, Tier 2, and OEMs.”

The e-Mobility session is supported by IPC’s e-Mobility Quality and Reliability Advisory Council and closely aligns with the council’s mission to help deliver e-Mobility quality, reliability, and safety while protecting the drive for innovation. IPC, in the first-of-its-kind event at IPC APEX EXPO’s e-Mobility/EV Automotive Special Session, will bring together stakeholders from OEMs, their supply chain, regulators, and policy and technology experts to discuss the many challenges as well as the collaborative based solutions to those challenges.

The e-Mobility/EV Automotive session is a three-hour panel discussion with audience participation encouraged. Registration for this Jan. 26 session will be included in the “All Access” or “Full Technical Conference” packages, or it can also be added as a “Technical Conference Single Session Pass.”

Registration for these Jan. 26 sessions will be included in the “All-Access” or “Full Technical Conference” packages, or it can also be added as a “Technical Conference Single Session Pass.”

Registration Options