Technical Conference

IPC APEX EXPO’s Technical Conference promises to showcase the latest original technical data from the world’s leaders in electronics manufacturing research. The Technical Conference paper presentations will cover the newest and unpublished results, techniques, materials, processes, and trends. IPC APEX EXPO 2023 will address the biggest issues facing the $2 trillion global electronics industry including boosting operational efficiency, improving product quality and reliability, innovations in advanced HDI and PCB HDI technologies, and outlook for Factory of the Future trends.

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Two Hot Topic Special Sessions on Thursday

  • Advanced Packaging
  • E-Mobility/EV Automotive
    Learn More

Choose sessions from five hot-topic tracks:

  • Factory of the Future and Future Technologies
  • PCB Fabrication and Materials
  • Quality, Reliability, Test and Inspection
  • Assembly and Materials
  • High-Density Interconnects and Microvias
Technical Conference Attendees
Factory of Future and Future Technologies
S07 | Factory of the Future - Additive Manufacturing

Presentation: Sustainable Smart Surfaces
Speaker: Dr. Outi Rusanen | Principal Interconnection Specialist, TactoTek

Presentation: 3D-Printing of Plastic Structures onto PCBs to Assist in the Protection of Electronic Circuits
Speaker: Dr. Stanton Rak | President, SF Rak Company

Tuesday, January 24 | 1:30 PM-3:00 PM

Outi Rusanen
Dr. Outi Rusanen | Principal Interconnection Specialist, TactoTek
Stanton Rak
Dr. Stanton Rak | President, SF Rak Company
S10 | ET - Technologies for Miniaturization

Presentation: Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs
Speaker: Ravi Parthasarathy | Sr. Application Engineer, ZESTRON Corporation

Presentation: Soft and Pliable Circuit Boards Made with a Novel Thermoset Polymer
Speaker: Tomohiro Fukao | Research Manager, Panasonic Corporation of North America

Tuesday, January 24 | 3:30 PM-5:00 PM

Ravi Parthasarathy
Ravi Parthasarathy | Sr. Application Engineer, ZESTRON Corporation
Tomohiro Fukao
Tomohiro Fukao | Research Manager, Panasonic Corporation of North America
S16 | Factory of the Future - Automated Inspection

Presentation: Real-time X-ray Video Imaging of Solder Paste on Hotstage Under Simulated SMT Reflow
Speaker: Dr. Norman Armendariz | Engineering Fellow, Raytheon Technologies

Presentation: Integrating Functional High-Speed Testing into the Structural Testing Process in Manufacturing
Speaker: Louis Ungar | President, A.T.E. Solutions, Inc.

Presentation: A Framework for Data Archiving and Edge CI/CD for Quality Inspection Implementation in Manufacturing Using Edge Computing
Speaker: Feng Xue | Senior Technical Staff Member, IBM Corporation

Wednesday, January 25 | 8:30 AM to 10:00 AM

Norman Armendariz
Dr. Norman Armendariz | Engineering Fellow, Raytheon Technologies
Louis Ungar
Louis Ungar | President, A.T.E. Solutions, Inc.
Feng Xue
Feng Xue | Senior Technical Staff Member, IBM Corporation
S20 | FF3 - Artificial Intelligence for Manufacturing

Presentation: AI-Based Design for Manufacturing in Selective Wave Soldering
Speaker: Reinhardt Seidel | Research Assistant, FAU Erlangen-Nürnberg, Institute for Factory Automation and Production Systems (FAPS)

Presentation: An AI Method for Early Detection of Failures Caused by Corrosion on Components During Assembly - Correlated to Field Failure Analysis Cases
Speaker: Dr. Eyal Weiss | CTO, Cybord ltd.

Presentation: The Brave New World of PCB Design Validation " Cloud-Based DFM and Collaboration
Speaker: Susan Kayesar | Technical Product Manager, Siemens Digital Industries SW

Wednesday, January 25 | 10:30 AM-12:00 PM

Reinhardt Seidel
Reinhardt Seidel | Research Assistant, FAU Erlangen-Nürnberg, Institute for Factory Automation and Production Systems (FAPS)
Eyal Weiss
Dr. Eyal Weiss | CTO, Cybord ltd.
Susan Kayesar
Susan Kayesar | Technical Product Manager, Siemens Digital Industries SW
S24 | Factory of the Future - Process

Presentation: Line Controller as Collaborative Agent to Orchestrate Processes and Taking Automation to the Next Level
Speaker: Danny Yeoh | Business Development Manager, camLine

Presentation: Synchronizing the Stencil Printing Process for Successful Central Database Recipe Control
Speaker: Edward Nauss | Sr. Sales and Applications Engineer, ITW/EAE

Presentation: CPH - The Hidden Loss
Speaker: Fernando Guedes | Global SMT MTT Manager, Aptiv
 

Danny Yeoh
Danny Yeoh | Business Development Manager, camLine
Edward Nauss
Edward Nauss | Sr. Sales and Applications Engineer, ITW/EAE
Fernando Guedes
Fernando Guedes | Global SMT MTT Manager, Aptiv
S28 | Factory of the Future - Smart Factory

Presentation: Supply Chain Trust for the Future Factory
Speaker: Hiroyuki Watanabe | Executive Director Global Security, NEC Corporation

Presentation: Private Wireless Networks for Digital Transformation of Manufacturing
Speaker: Dr. Aroon Tungare | CEO, NODABL Networks, Inc.

Presentation: Envisioning Future Haptic Enhanced VR Curriculum for Electronics and Vocational Education for the Post-Pandemic-Era
Speaker: Dr. Jose James | Research & Development Scientist, STRAC Institute & Brown University | Providence, RI, USA

Wednesday, January 25 | 3:30 PM-5:00 PM

Hiroyuki Watanabe
Hiroyuki Watanabe | Executive Director Global Security, NEC Corporation
Aroon Tungare
Dr. Aroon Tungare | CEO, NODABL Networks, Inc.
Jose James
Jose James | Research & Development Scientist, STRAC Institute & Brown University Providence, RI, USA
PCB Fabrication and Materials
S03 | BF-MAT-1 Printed Board Platings and Finishes 1

Presentation: A novel copper via filling electrolyte for plating at high current densities for IC-Substrates
Speaker: Mustafa –xkök | Global Product Manager Panel and Pattern Plating, MKS Atotech GmbH

Presentation: Novel Surface Finish for 5G-mmWave frequency PCB Technologies- How to Achieve Optimum Signal Integrity
Speaker: Dr. Kunal Shah | President, LiloTree

Presentation: Reassessing Surface Finish Performance for Next Generation Technology
Speaker: Dr. Frank Xu | Technology Manager, MacDermid Alpha Electronics Solutions

Tuesday, January 24 | 10:30 AM-12:00 PM

Mustafa ÖxkÖk
Mustafa –xkök | Global Product Manager Panel and Pattern Plating, MKS Atotech GmbH
Kunal Shah
Dr. Kunal Shah | President, LiloTree
Frank Xu
Dr. Frank Xu | Technology Manager, MacDermid Alpha Electronics Solutions
S08 | BF-MAT-2 Printed Board Platings and Finishes 2

Presentation: Enabling Non-toxic Stabilization for Mixed Reaction Gold Electrolytes 
Speaker: Dr. Britta Schafsteller | Global Product Manager Selective Finishing, Atotech Group

Presentation: IPC-4552B and IPC-4556: ENIG and ENEPIG; The Nickel is Also Important
Speaker: Robert Weber | Technology Director, Fischer Technology

Presentation: Solvent Free Copper Extraction
Speaker: Derek Lovejoy | Student/Chemical Engineer, University of Massachusetts/GreenSource Fabrication

Tuesday, January 24 | 1:30 PM-3:00 PM

Britta Schafsteller
Dr. Britta Schafsteller | Global Product Manager Selective Finishing, Atotech Group
Robert Weber
Robert Weber | Technology Director, Fischer Technology
  Derek Lovejoy | Student/Chemical Engineer, University of Massachusetts/GreenSource Fabrication
S12 | BF-MAT-3 Printed Board Material Innovations

Presentation: Hybrid Adhesion Enhancement Systems and its Quality Control for low loss PCB Inner Layer bonding
Speaker: Christopher Seidemann | Global Product Manager, Atotech Group

Presentation: Development of Low Loss Adhesive Film for Multilayer PTFE Substrate
Speaker: Yusuke Watase | Staff Engineer, Showa Denko Materials co., Ltd.

Tuesday, January 24 | 3:30 PM-5:00 PM

Christopher A. Seidemann
Christopher Seidemann | Global Product Manager, Atotech Group
Yusuke Watase
Yusuke Watase | Staff Engineer, Showa Denko Materials co., Ltd.
Quality, Reliability, Test and Inspection
S04 | QRTI- Packaging Assembly Reliability

Presentation: Quality Assurance for Advanced Packaging Prototyping " Solder Paste Behavior as Key Monitoring Parameter
Speaker: Mattis Obst | Scientist, Fraunhofer IZM

Presentation: QFN Thermal Pad Design for Solder Joint Void Minimization
Speaker: Lars Bruno | Sr Engineer, PBA Manufacturing & Reliability, Ericsson AB

Tuesday, January 24 | 10:30 AM-12:00 PM

  Mattis Obst | Scientist, Fraunhofer IZM
Lars Ederleh
Lars Bruno | Sr Engineer, PBA Manufacturing & Reliability, Ericsson AB
S13 | QRTI- Printed Board Reliability

Presentation: Root Cause Analysis and Risk Assessment of a Multilayer Ceramic Capacitor Flexure Crack Propagating Fault
Speaker: Jennifer Bennett | Failure Analysis Engineer, IBM Corporation

Presentation: Controlling Recrystallisation in Plated Layers Through the Use of Additives
Speaker: Roger Massey | Technical Marketing Manager, Atotech Group

Presentation: Reliability Impact of Frequent Power Cycles on Base Printed Wiring Boards
Speaker: Karl Sauter | Senior Principal Engineer, PCB Technology, Oracle Corporation

Wednesday, January 25 | 8:30 AM-10:00 AM

Jennifer Bennett
Jennifer Bennett | Failure Analysis Engineer, IBM Corporation
Roger Massey
Roger Massey | Technical Marketing Manager, Atotech Group
Karl Sauter
Karl Sauter | Senior Principal Engineer, PCB Technology, Oracle Corporation
S17 | QRTI- Component Assembly Reliability 1

Presentation: Effect of Aging on BGA Solder Strengths & Assembly
Speaker: Dr. Reza Ghaffarian | Principal Engineer, JPL

Presentation: Selectively Assembling High Value Components Based on Warpage in Order to Improve Reliability
Speaker: Neil Hubble | President, Akrometrix

Presentation: Analysis of Pull Force Test Results for Crimped Connections
Speakers: Dr. Alejandra Constante-Perez | Materials Engineer, Axient Corp
Christopher Fitzgerald | Quality Assurance Engineer, Millennium Engineering & Integration Company

Wednesday, January 25 | 10:30 AM-12:00 PM

Reza Ghaffarian
Dr. Reza Ghaffarian | Principal Engineer, JPL
Neil Hubble
Neil Hubble | President, Akrometrix
Alejandra C. Perez
Dr. Alejandra Constante-Perez | Materials Engineer, Axient Corp
Christopher Fitzgerald
Christopher Fitzgerald | Quality Assurance Engineer, Millennium Engineering & Integration Company
S21 | QRTI- Component Assembly Reliability 2

Presentation: Monitoring Solder Paste Activity with Electrochemical Impedance Spectroscopy to Ensure Uniform Mixing
Speaker: Rachel Schwartz | Materials Engineer, Insituware LLC

Presentation: Requirements for Soldering Fluxes Research using the B-53 Test Board
Speaker: Mark McMeen, V.P. Engineering, Magnalytix

Wednesday, January 25 | 1:30 PM-3:00 PM

  Rachel Schwartz | Materials Engineer, Insituware LLC
Mark McMeen
Mark McMeen | V.P. Engineering, Magnalytix
S25 | QRTI-Assembly Risk Prediction and Failure Analysis

Presentation: Failure Analysis of High-Speed Cables Due to Molecular Degradation of Wire Insulation
Speaker: Eric Campbell | Advisory Hardware Development Engineer, IBM Corporation

Presentation: Risk Prediction of Electrochemical Migration on Electronic Control Units " A Practical Approach
Speaker: Dr. Lothar Henneken | Senior Expert, Robert Bosch

Presentation: Prediction of Drop Impact Reliability for Electronics Using Finite Element Analyses
Speaker: Marius Tarnovetchi | Senior Expert, Vitesco Technologies

Wednesday, January 25 | 3:30 PM-5:00 PM

Eric Campbell
Eric Campbell | Advisory Hardware Development Engineer, IBM Corporation
Lothar Henneken
Dr. Lothar Henneken | Senior Expert, Robert Bosch
Marius Tarnovetchi
Marius Tarnovetchi | Senior Expert, Vitesco Technologies
Assembly and Materials
S01 | Assembly Process

Presentation: Photonic Soldering of WLCSP on PET Flex with Quality and Reliability Analysis
Speaker: Dr. Harry Chou | Engineer, PulseForge

Presentation: Selective Soldering Nozzles: Insights into Wear Mechanisms and Future Developments
Speaker: Dr. Sam McMaster | Materials Scientist, Pillarhouse International

Presentation: New Soldering Technology for High and Mixed Volume Through-hole Pin Devices
Speaker: Gerjan Diepstraten | Advanced Technology Manager ITWEAE

Tuesday, January 24 | 10:30 AM-12:00 PM

Harry Chou
Dr. Harry Chou | Engineer, PulseForge
Sam McMaster
Dr. Sam McMaster | Materials Scientist, Pillarhouse International
Gerjan Diepstraten
Gerjan Diepstraten | Advanced Technology Manager ITWEAE
S05 | A-REW Assembly Rework and Repair

Presentation: Non-Destructive BGA Rework using Infra-Red Heating Technology
Speaker: Aaron Caplan | Senior Consultant, PACE Worldwide

Presentation: Novel Automatic Repair of Populated PCBs in a Cost-effective and Adaptive Way
Speaker: Irving Rodriguez | Product Specialist Dispensing, Essemtec Nano-Dimension

Presentation: Effects of BGA Rework on Board-Level Reliability
Speaker: Mei Ming Khaw | Engineering Program Manager, Keysight Technologies

Tuesday, January 24 | 1:30 PM-3:00 PM

Aaron Caplan
Aaron Caplan | Senior Consultant, PACE Worldwide
Irving Rodriguez
Irving Rodriguez | Product Specialist Dispensing, Essemtec Nano-Dimension
Mei Ming Khaw
Mei Ming Khaw | Engineering Program Manager, Keysight Technologies
S09 | A-LASER Assembly Laser Processing

Presentation: Temperature Behavior of FR4 Substrates when Processing during Laser Depaneling
Speaker: Patrick Stockbruegger | Product Manager, LPKF Laser & Electronics AG

Presentation: Moving Towards Failure-free and Higher Efficient PCB Depaneling Methods with Laser Technology
Speaker: Lars Ederleh | Chief Sales Officer (CSO), Photonics System Group

Tuesday, January 24 | 3:30 PM-5:00 PM

Patrick Stockbrügger
Patrick Stockbruegger | Product Manager, LPKF Laser & Electronics AG
Lars Ederleh
Lars Ederleh | Chief Sales Officer (CSO), Photonics System Group
S15 | EM1- Electronic Materials Thermal Interface Materials - TIMS

Presentation: Critical Factors for Minimizing Interfacial Resistance in Thermal Interface Material Applications
Speaker: John Prindl | Regional Application Engineering Manager, Industrials, Henkel Corporation

Presentation: High-Performance Phase Change Metal TIMs
Speaker: Milos Lazic | Product Development Specialist, Indium Corporation

Wednesday, January 25 | 8:30 AM-10:00 AM

John Prindl
John Prindl | Regional Application Engineering Manager, Industrials, Henkel Corporation
Milos Lazic
Milos Lazic | Product Development Specialist, Indium Corporation
S19 | EM2-LTS Electronic Materials Low Temperature Solder

Presentation: Energy Consumption Reduction Using Low Temperature Solder Alloys
Speaker: Claire Hotvedt | Senior Product Development Specialist, Indium Corporation

Presentation: A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305
Speaker: Dr. Hongwen Zhang | R&D Manager, Indium Corporation

Wednesday, January 25 | 10:30 AM-12:00 PM

Claire Hotvedt
Claire Hotvedt | Senior Product Development Specialist, Indium Corporation
Hongwen Zhang
Dr. Hongwen Zhang | R&D Manager, Indium Corporation
S23 | EM3-C&C Electronic Materials Cleaning and Coating 1

Presentation: Investigation of the electrochemical reliability of conformal coatings under high voltage
Speaker: Dr. Heiko Elsinger | Senior Expert, Robert Bosch GmbH

Presentation: Low Outgassing and Ionic Content, High-Performance Light and Moisture Dual Curable Conformal Coating
Speaker: Dr. Aysegul Nebioglu | Senior Manager, R&D, Global, Dymax

Wednesday, January 25 | 1:30 PM-3:00 PM

Heiko Elsinge
Dr. Heiko Elsinger | Senior Expert, Robert Bosch GmbH
Aysegul Nebioglu
Dr. Aysegul Nebioglu | Senior Manager, R&D, Global, Dymax
S27 | EM4-C&C2 Electronic Materials Cleaning and Coating 2

Presentation: New Approaches to Conformal Coating Demonstrate Significantly Improved Ruggedization Performance
Speaker: Phil Kinner | Head of R&D, ELECTROLUBE a division of MacDermid Alpha Electronics Solutions

Presentation: An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Speaker: Laura Lecomte | R&D Manager, Inventec

Wednesday, January 25 | 3:30 PM-5:00 PM

Phil Kinner
Phil Kinner | Head of R&D, ELECTROLUBE a division of MacDermid Alpha Electronics Solutions
Laura Lecomte
Laura Lecomte | R&D Manager, Inventec
High-Density Interconnects and Microvias
S02 | EX 1- High Reliability for Extreme Environments 1

Presentation: A High Thermal Performance Die Attaching Paste based on Hybrid Pressure-less Silver Sintering Technology for Aerospace Applications
Speaker: Dr. Yuan Zhao | Principal Engineer, Henkel Corporation

Presentation: Expandable Bio-based Polymers: A Lightweight Future for Electronics Ruggedization
Speaker: Bethany Turner | Technical Manager | ELECTROLUBE a division of MacDermid Alpha Electronics Solutions

Presentation: Failure Characteristic of PCBs in Automotive EV Powertrain Applications and Solution Proposals to Improve Reliability and Robustness
Speaker: Dr. Walter Olbrich | Director Field Application Engineering, TTM Technologies

Tuesday, January 24 | 10:30 AM-12:00 PM

Yuan Zhao
Dr. Yuan Zhao | Principal Engineer, Henkel Corporation
Bethany Turner
Bethany Turner | Technical Manager, ELECTROLUBE a division of MacDermid Alpha Electronics Solutions
Walter Olbrich
Dr. Walter Olbrich | Director Field Application Engineering, TTM Technologies
S06 | EX 2- High Reliability for Extreme Environments 2

Presentation: Using Flux-Coated Solder Prefoms to Repeatably Achieve Low Voiding Under Power ICs: An Automotive Case Study
Speaker: Andreas Karch | Regional Technical Manager and Technologist – Advanced Applications, Indium Corporation

Presentation: Highly Accelerated Vibration Testing for the Evaluation of Solder Alloys in Automotive Applications
Speaker: Kennedy Fox | Reliability Failure Analysis Scientist, MacDermid Alpha Electronics Solutions

Presentation: Combined Alloy and Flux Approach towards Cost-Effective High Reliable Solder Joints for Automotive Applications
Speaker: Manu Vaidya | Global Product Manager, Heraeus Deutschland GmbH

Tuesday, January 24 | 1:30 PM-3:00 P

Andreas Karch
Andreas Karch | Regional Technical Manager and Technologist – Advanced Applications, Indium Corporation
Kennedy Fox
Kennedy Fox | Reliability Failure Analysis Scientist, MacDermid Alpha Electronics Solutions
Manu Vaidya
Manu Vaidya | Global Product Manager, Heraeus Deutschland GmbH
S11 | HDI1 - Microvia Analysis and Modeling

Presentation: A Microvia Damage Model
Speaker: Dr. Michael Lovellette | Physicist, The Aerospace Corporation

Presentation: High Resolution Physical Analyses of Microvia - Target Pad Interfaces
Speaker: Dr. Martin Leung | Senior Project LeaderThe Aerospace Corporation

Tuesday, January 24 | 3:30 PM-5:00 PM

Michael Lovellette
Dr. Michael Lovellette | Physicist, The Aerospace Corporation
Martin Leung
Dr. Martin Leung | Senior Project LeaderThe Aerospace Corporation
S14 | HDI2 - Microvia Formation

Presentation: Thermal Reliability of Vias Metalized with a Semi-Additive Process (SAP)
Speaker: Gus Karavakis | Director-Advances Process Development, Averatek

Presentation: A Fully Additive Approach for High-Density Interconnect Printed Circuit Boards
Speaker: Dr. Roghayeh Imani | Researcher, EISLAB, Department of Computer Science, Electrical, & Space Engineering Luleå Technical University, Luleå, Sweden

Presentation: Chemical and Microscopic Analyses of Laser Microvia Samples
Speaker: Dr. Gouri Radhakrishnan | Senior Scientist, The Aerospace Corporation

Wednesday, January 25 | 8:30 AM-10:00 AM

Konstantine Karavaki
Gus Karavakis | Director-Advances Process Development, Averatek
Roghayeh Imani
Dr. Roghayeh Imani | Researcher, EISLAB, Department of Computer Science, Electrical, & Space Engineering Luleå Technical University, Luleå, Sweden
Gouri Radhakrishnan
Dr. Gouri Radhakrishnan | Senior Scientist, The Aerospace Corporation
S18 | HDI3 - Microvia Substrates

Presentation: Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
Speaker: Dr. Thomas McCarthy | Product Development Manager, AGC

Presentation: High Density PCB technology for High Reliability Applications Using Low CTE material
Speaker: Joachim Verhegge | Product Engineering Manager, ACB NV (Advanced Circuit Boards)

Presentation: Challenge: Sourcing ELIC Substrates in the USA
Speaker: Jerry Magera | Distinguish Innovator, Chemical Engineer, Motorola Solutions

Wednesday, January 25 | 10:30 AM-12:00 PM

Thomas McCarthy
Dr. Thomas McCarthy | Product Development Manager, AGC
Joachim Verhegge
Joachim Verhegge | Product Engineering Manager, ACB NV (Advanced Circuit Boards)
Jerry Magera
Jerry Magera | Distinguish Innovator, Chemical Engineer, Motorola Solutions
S22 | HDI4 - Microvia Plating

Presentation: Copper Pulse Electroplating for High-Aspect-Ratio Through Holes
Speaker: Dr. Crystal Zhang | Staff Associate Investigator, DuPont

Presentation: Improved Reliability of Via Connection by Thinning Electroless Copper Plating
Speaker: Hidekazu Honma | Chief Research, OKUNO Chemical Industries CO.,LTD

Wednesday, January 25 | 1:30 PM-3:00 PM

Crystal Zhang
Dr. Crystal Zhang | Staff Associate Investigator, DuPont
Hidekazu Homma
Hidekazu Honma | Chief Research, OKUNO Chemical Industries CO.,LTD
S26 | HDI 5- Stacked, Staggered and Buried Microvias

Presentation: Contributing Factors to the Reliability of Buried Vias in High-Density Interconnect PCBs
Speaker: Dr. Maarten Cauwe | R&D Team Leader, imec-Cmst

Wednesday, January 25 | 3:30 PM-5:00 PM

Maarten Cauwe
Dr. Maarten Cauwe | R&D Team Leader, imec-Cmst
Full Conference

Includes all technical conference paper sessions, online conference proceedings, standards development committee meetings and PERM Meeting #53 (luncheons not included).

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