Special Conference Sessions
Advanced Packaging for High Performance Computing and AI/Data Center Applications
Thursday, March 20
8:30 am-11:30 am
AI/data center applications with high performance computing chips demand high density and high-performance advanced packaging solutions including chiplets assembly. This session will provide advanced packaging advancements and insights on design, materials, assembly and reliability challenges and potential approaches to mitigate some of these challenges. There will be discussions centered around electrical- thermal- mechanical co design/ modeling, materials and process technologies, reliability testing, and metrology tools needed for the design and manufacturing of these complex packaging solutions for AI/data center applications.
Please join us for this important session that will provide needs and insights into next generation packaging solutions for high performance computing and discussions on some of the enabling technologies.
Advanced Packaging for EV Power Electronics
Thursday, March 20
11:30 am-2:00 pm
"Advanced Packaging for EV Power Electronics," will explore innovative design methodologies that enhance reliability under extreme conditions, alongside advancements in materials science that improve durability and performance. Specialized techniques in assembly processes to enhance precision, mitigate parasitic effects, and improve interconnect reliability will be addressed. Additionally, testing techniques to validate thermo-mechanical and thermal performance and ensuring compliance with stringent automotive requirements and real-world operating conditions will be discussed. Join us to explore how these developments in advanced packaging are shaping the future of EV power electronics!
Agenda
Speaker: Lars Böttcher, Group Manager, Fraunhofer IZM Berlin
|
Summary:
Power modules play a critical role in the efficient and reliable operation of various electrical systems, ranging from power systems to electric vehicles.
To take advantage of the excellent switching characteristics of SiC at very low losses, the use of new packaging technologies is required.
Embedding MOSFETs in PCB structures offers numerous advantages, including lower parasitic inductance, improved heat dissipation and enhanced switching performance.
Concepts for realizing modules with embedding technology up to 900 V and 850 A are presented.
Speaker: Dr. Stefan Behrendt, Senior Research Engineer, Semikron Danfoss
|
Summary:
Automotive applications face the packaging of power electronic modules with a multitude of challenges. Small building spaces, high power densities, and high demands with regards to reliability generate the need for highly robust and cost effective bonding and joining technologies. Different packaging technologies as well as materials are critical factors for the performance and robustness of said power modules.
Speaker Dr. Olaf Schoenfeld, Sales Manager, Zestron
|
Summary:
The assembly of sintered power module packages poses new challenges in terms of reliability. This is significantly influenced by stress factors during the manufacturing process and further processing for integration into the EV's power train. In the production process of power module packages, various process steps interface challenges can be identified that determine the yield. In addition, Mold delamination is discussed as a typical quality issue for the reliability of sintered power modules and the resulting failure modes under HV like Anodic migration. The presentation will highlight individual challenges for assembly interfaces and show an efficient solution to address these through a targeted surface treatment process. Results on surface analysis and stress test behavior underpin the presented approach.
Registration for these March 20 sessions will be included in the All-Access, Committee Meetings Plus Conference, and Full Technical Conference packages, or it can also be added as a Technical Conference Single Session Pass.