Event Sponsors

   

Event Premier Sponsor


Event Supporting Sponsor


Event Supporting Sponsor

Omron Logo

 

3D Printing Metal vs. Plastic


 

Hand Sanitizer Sponsor

ARCG Logo

Keynote Sponsor

Nano Dimension Logo

Lanyard Sponsor


Newcomer's Networking Reception

SICK Logo

Notepad Sponsor


Pen Sponsor

Chemcut Logo

Reusable Water Bottle Sponsor

Omron Logo

 

Show Bag Sponsor

Kyzen Logo

Technical Conference Technical Program Committee

Stanton Rak, Ph.D. - CHAIR, SF Rak Co.
Udo Welzel, Ph.D. - CO-CHAIR, Robert Bosch GmbH
Beverley Christian, Ph.D., HDP User Group
Bhanu Sood, Ph.D., NASA Goddard Space Flight Center
Eric Campbell, IBM Corporation
Jason Keeping, Celestica International L.P.
John Bauer, Collins Aerospace
Laura Cohen, Ph.D., Continental Automotive Systems, Inc.
Martin Goetz, Northrop Grumman Corporation
Michael Carano, Averatek
Michael Ford, Aegis Industrial Software
Milos Lazic, Indium Corporation
Paige Fiet, TTM Technologies
Paul Cooke, Asahi Glass Co. Ltd-Taconic
Robert Kinyanjui, Ph.D., John Deere Electronic Solutions
Sarah Czaplewski-Campbell, IBM Corporation

IPC APEX Trade Show Subcommittee

Chairman, Mark Ogden, ASM Assembly Systems
Jason Spera, Aegis Industrial Software Corporation
Mike Foster, Europlacer North America
Chip King, Fuji America Corporation
Marc Peo, Heller Industries
Brent Fischthal, Koh Young Technology Inc.
​​Paul Keehn, Kulicke & Soffa
Joe Clure, Kurtz Ersa Inc.
Brad Ward, Omron Inspection Systems
Phil Dlatt, Panasonic Factory Solutions Company of America
Jesper Lykke, Viscom Incorporated
Matt Wyglensowski, Yamaha Motor IM America Inc.

IPC EXPO Trade Show Subcommittee

Chairman, Kurt Palmer, Burkle North America
Rick Lies, Chemcut Corporation
John Lee, Insulectro
Joe Clure, Kurtz Ersa Inc.
John Fix, Taiyo America, Inc.
Mark Eonta, Uyemura International Corporation

Media Supporters

ASSEMBLY Magazine
Dempa
eBOM
Electronics Sourcing North America (ESNA)
EIN007
EMSNOW
FLEX007
Global SMT & Packaging
i4.0 Today
MilAero007
​​​​PCB007
PCB Design007
Power Electronics World
Printed Circuit Design & Fab Magazine
Manufacturing Technology Insights
Highland Street Media
Scoop Communications
Signal Integrity Journal
Silicon Semiconductor
SMT Today
SMT007
U.S. Tech
Wiring Harness News
What's New in Electronics (WNIE)

Supporting Associations

AIM Global, Inc.
Automotive Industry Action Group (AIAG)
China Printed Circuit Association (CPCA)
European Institute for the PCB Community (EIPC)
Hong Kong Printed Circuit Association (HKPCA)
Korea Printed Circuit Asssociation (KPCA)
MicroElectronics Packaging and Test Engineering Council (MEPTEC)
Mesago Messe Frankfurt Group
Taiwan Printed Circuit Association (TPCA)