Event Sponsors |
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Premier Sponsor |
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Supporting Sponsor |
Hand Sanitizer Sponsor |
Lanyard Sponsor |
Notepads
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Reusable Water Bottle Sponsor
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Show Bag Sponsor |
Women in Electronics Reception
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Technical Conference Program Committee
Stanton Rak, Ph.D. – Co-CHAIR, SF Rak Co.
Udo Welzel, Ph.D. – Co-CHAIR, Robert Bosch GmbH
Bethany Turner, ELECTROLUBE a division of MacDermid Alpha Electronics Solutions
Beverley Christian, Ph.D., HDP User Group
Bhanu Sood, Ph.D., NASA Goddard Space Flight Center
Eric Campbell, IBM Corporation
Igor Bulavitchi, Flex
John Bauer, Collins Aerospace
Kuldip Johal, MKS Instruments, Inc., Atotech
Larry Pymento, Intel
Laura Cohen, Ph.D., Woodward Inc.
Maarten Cauwe, Ph.D., IMEC
Martin Goetz, Northrop Grumman Corporation
Michael Schleicher, Semikron Danfoss
Milos Lazic, Indium Corporation
Palash Vyas, Ph.D., Veoneer
Paul Cooke, AGC
Robert Kinyanjui, Ph.D., John Deere Electronic Solutions
Romuald Roucou, Ph.D., NXP Semiconductors
Samuel McMaster, Ph.D., Pillarhouse International
Sarah Czaplewski-Campbell, IBM Corporation
Sunny Agarwal, Illinois Tool Works Electronic Assembly Equipment (ITWEAE)
Thomas F. McCarthy, AGC Multi Materials America
Tim Burke, Ph.D., Arch Systems, Inc.
Todd MacFadden, Bose Corporation
Wade Goldman, Draper Laboratory
IPC APEX Trade Show Subcommittee
Chairman, Mark Ogden, ASMPT
Jason Spera, Aegis Industrial Software Corporation
Joe Clure, Kurtz Ersa Inc.
Mike Foster, Europlacer North America
Marie Ko, Fuji America Corporation
Marc Peo, Heller Industries
Brent Fischthal, Koh Young Technology Inc.
Paul Keehn, Kulicke & Soffa
Joe Clure, Kurtz Ersa Inc.
Nick Fieldhouse, Omron Inspection Systems
Phil Dlatt, Panasonic Factory Solutions Company of America
Jesper Lykke, Viscom Incorporated
Matt Wyglensowski, Yamaha Motor IM America Inc.
IPC EXPO Trade Show Subcommittee
Chairman, Kurt Palmer, Burkle North America
Rick Lies, Chemcut Corporation
John Lee, Insulectro
John Fix, Taiyo America, Inc.
Mark Eonta, Uyemura International Corporation
Media Supporters
Adhesives & Sealants Industry (ASI)
ASSEMBLY Magazine
eBOM
EDACafe
EIN007
Electronics Sourcing North America (ESNA)
EMSNOW
EPP-EPP EU
FLEX007
Global SMT & Packaging
Highland Street Media
i4.0 Today
Manufacturing Technology Insights
MilAero007
PCB007
PCB Design007
Printed Circuit Design & FAB
Power Electronics World
Scoop Communications
Signal Integrity Journal
Silicon Semiconductor
SMT Today
SMT007
U.S. Tech
Wiring Harness News
What's New in Electronics (WNIE)
Supporting Associations
AIM Global, Inc.
Automotive Industry Action Group (AIAG)
China Printed Circuit Association (CPCA)
Electronic Industries Association of India (ELCINA)
European Institute for the PCB Community (EIPC)
Hong Kong Printed Circuit Association (HKPCA)
India Printed Circuit Association (IPCA)
Japan Printed Circuit Association (JPCA)
Korea Printed Circuit Asssociation (KPCA)
MicroElectronics Packaging and Test Engineering Council (MEPTEC)
Mesago Messe Frankfurt Group
Surface Mount Technology Association (SMTA)
Taiwan Printed Circuit Association (TPCA)
Thailand Printed Circuit Association (THPCA)