Call for Participation: Technical Paper

Assembly Processes Topics
Circuit Design and Component Technologies Topics
Embedded Passive and Active Devices: CAD Design Tools
Wire Bonding: Ultra-thin Die Assembly
Conscientious Engineering Topics
Electronics Materials Topics
Pb-free Alloys: Low temperature soldering
Enabling Future Technologies Topics
Factory of the Future Implementation Topics
Meeting Extreme Requirements Topics
Power Electronics: Battery Technologies
PCB Fabrication and Materials Topics
Quality, Reliability, Test and Inspection Topics
Automated Inspection (SPI, AOI, AXI): sub-topics
Surface Reliability: sub-topics
How will you present this paper?
This title will be used in the agenda and directory.
Abstract is used for speaker selection and also may be used for promotional materials .
Were you referred by a Technical Program Committee member?
Has this paper previously been published?
Have you presented on this topic before?
Conference Paper Timeline
Abstracts due August 31, 2020
Acceptance/status of your submittal by September 30, 2020
Papers are due November 11, 2020
Presentations are due December 9, 2020

Please allow up to five business days for us to confirm receipt of your submission.