Salutation *
Assembly Processes Topics
Circuit Design and Component Technologies Topics
Embedded Passive and Active Devices: CAD Design Tools - Optional
Wire Bonding: Ultra-thin Die Assembly - Optional
Conscientious Engineering Topics
Electronics Materials Topics
Pb-free Alloys: Low temperature soldering - Optional
Enabling Future Technologies Topics
Factory of the Future Implementation Topics
Meeting Extreme Requirements Topics
Power Electronics: Battery Technologies - Optional
PCB Fabrication and Materials Topics
Quality, Reliability, Test and Inspection Topics
Automated Inspection (SPI, AOI, AXI): sub-topics - Optional
Surface Reliability: sub-topics - Optional
This title will be used in the agenda and directory.
Abstract is used for speaker selection and also may be used for promotional materials .
Based on your ability to travel, are you planning to present your work *
Is technical project / experimentation work complete at the time of this abstract submission? *
Were you referred by a Technical Program Committee member? *
Has this paper previously been published? *
Have you presented on this topic before? *
Conference Paper Timeline
Abstracts due August 6, 2021
Acceptance/status of your submittal by August 20, 2021
Papers are due October 8, 2021
Presentations are due November 12, 2021

Please allow up to five business days for us to confirm receipt of your submission.