IPC APEX EXPO

2017 Call for Posters

Deadline for Abstracts: Friday, October 22, 2016

Show a technical poster at one of the industry's premier conferences on electronics manufacturing. Gain significant visibility for you and your company on your research and knowledge. Thousands of individuals will attend IPC APEX EXPO, ensuring that your work is seen by key engineers, managers and executives from all segments of the electronic interconnect industry worldwide. Posters will be displayed throughout the event. Poster presentations are scheduled for Wednesday, February 15th, 2017 offering additional visibility.

Poster Topics

Submissions are sought in all areas of the electronics industry, including design, materials, assembly, processes and equipment, especially:

  • 3D Printing in Electronics Manufacturing
  • Automation in Electronics Manufacturing
  • Adhesives
  • Advanced Technology
  • Area Array/Flip Chip/0201 Metric
  • Assembly and Rework Processes
  • BGA/CSP Packaging
  • Black Pad and Other Board Related Defect Issues
  • BTC/QFN/LGA/MLF Components
  • Business & Supply Chain Issues
  • Cleaning
  • Conformal Coatings
  • Corrosion
  • Counterfeit Electronics
  • Design
  • Electromigration
  • Electronics Manufacturing Services
  • Embedded Passive & Active Devices
  • Environmental Compliance
  • Graphene in Electronics Manufacturing
  • Lean Six Sigma
  • LED Manufacturing
  • Failure Analysis
  • Flexible Circuitry
  • HDI Technologies
  • Head-on-Pillow
  • •Board and Component Warpage
  • High Speed, High Frequency & Signal Integrity
  • Industry 4.0
  • Lead-Free Fabrication, Assembly & Reliability
  • Miniaturization
  • Nanotechnology
  • Optoelectronics
  • Packaging & Components
  • PCB Fabrication
  • PCB and Component Storage & Handling Performance
  • Quality & Reliability
  • Photovoltaics
  • PoP (Package-on-Package)
  • Printed Electronics
  • Reshoring
  • RFID Circuitry
  • Robotics
  • Soldering
  • Surface Finishes
  • Test, Inspection & AOI
  • Tin Whiskers
  • 2.5-D/3-D Component Packaging
  • Underfills
  • Via Plugging & Other Protection
  • Wearables

For more information about poster participation, contact Jasbir Bath, IPC technical conference director, at JasbirBath@ipc.org or Toya Richardson, IPC Technical Programs Coordinator, at ToyaRichardson@ipc.org or +1 847-597-2823.

Requirements for Submission

Provide an abstract of up to 300 words that summarizes technical and previously unpublished work covering case histories, research and discoveries.

Poster Presenter Benefits

Poster presenters are entitled to a free One-Day Conference Pass for Wednesday, February 15, 2017.