IPC APEX EXPO

2017 Call for Participation

Submit an abstract for one of the industry's premier technical conferences or provide a course proposal for one of its largest educational events. Presenting at IPC APEX EXPO 2017 in San Diego will provide significant visibility for you and your company. Thousands of individuals will receive the technical proceedings of the conference, ensuring that your published paper will be seen by key engineers, managers and executives from all segments of the worldwide electronic interconnection industry. Presenting a technical conference paper or teaching a professional development course is a unique and cost-effective channel to promote your expertise and your organization to your customers and prospects.

TOPICS for Technical Conference Papers and Professional Development Courses

  • 3D Printing in Electronics Manufacturing
  • Automation in Electronics Manufacturing
  • Adhesives
  • Advanced Technology
  • Area Array/Flip Chip/0201 Metric
  • Assembly and Rework Processes
  • BGA/CSP Packaging
  • Black Pad and Other Board Related Defect Issues
  • BTC/QFN/LGA Components
  • Business & Supply Chain Issues
  • Cleaning
  • Conformal Coatings
  • Corrosion
  • Counterfeit Electronics
  • Design
  • Electromigration
  • Electronics Manufacturing Services
  • Embedded Passive & Active Devices
  • Environmental Compliance
  • Graphene in Electronics Manufacturing
  • Lean Six Sigma
  • LED Manufacturing
  • Failure Analysis
  • Flexible Circuitry
  • HDI Technologies
  • Head-on-Pillow
  • Board and Component Warpage
  • High Speed, High Frequency & Signal
  • Industry 4.0
  • Integrity
  • Lead-Free Fabrication, Assembly & Reliability
  • Miniaturization Nanotechnology Optoelectronics
  • Packaging & Components
  • PCB Fabrication
  • PCB and Component Storage & Handling Performance
  • Quality & Reliability
  • Photovoltaics
  • PoP (Package-on-Package)
  • Printed Electronics
  • Reshoring
  • RFID Circuitry
  • Robotics
  • Soldering
  • Surface Finishes
  • Test, Inspection & AOI
  • Tin Whiskers
  • 2.5-D/3-D Component Packaging
  • Underfills
  • Via Plugging & Other Protection
  • Wearables

Technical Conference

Requirements for Submission

Provide an abstract of approximately 300 words that summarizes technical work, covering case histories, research and discoveries. Authors of papers selected for the conference will each receive a detailed speaker manual to assist them with numerous items, including the formatting of their papers and presentation slides.

The selection process is competitive and sufficient detail needs to be included to allow the Technical Program Committee to properly assess content of the proposed paper. The paper should be noncommercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Presentations will be limited to 30 minutes, which includes approximately 5 minutes for questions and answers.

Conference Benefits

Conference speakers are entitled to a free one-day conference pass for the day of their presentations, discounted registration fees for the full conference and complimentary admission to the exhibit hall.

All speakers selected for papers who provide both their paper and presentation to IPC by October 14th 2016 will be eligible for a free full-conference pass.

Conference Awards

To recognize exceptional achievement, awards will be presented for "Best Paper." Each award consists of a recognition plaque and a $1,000 prize. Co-authors share the honorarium, but all will receive individual recognition plaques.

Please Note

Previously published papers and/or commercially focused papers are not appropriate and will not be accepted.

Conference Paper Timeline

  • Abstracts due June 17, 2016
  • Acceptance/status of your submittal by August 12, 2016
  • Papers are due October 14, 2016
  • Presentations are due November 14, 2016

Professional Development Courses

Course proposals are solicited from individuals interested in teaching half-day (three-hour) professional development courses on design, manufacturing processes and materials. Travel expenses and honorariums are offered to professional development instructors.

Professional Development Timeline

  • Proposals due August 5, 2016
  • Acceptance by September 9, 2016
  • Final presentation revisions due November 7, 2016

Abstract and Proposal Instructions

Submit your Conference paper abstract or Professional Development Course proposal online.

For more information about conference participation, please contact Conference Director Jasbir Bath at JasbirBath@ipc.org, or Toya Richardson at ToyaRichardson@ipc.org or +1 847-597-2825.

For more information on professional development courses, contact Andrea Pinc at AndreaPinc@ipc.org or Anne Marie Mulvihill at AnneMarieMulvihill@ipc.org.