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Technical Conference
Tuesday–Thursday, April 12–14

Known worldwide as one of the finest and most selective in the world, the IPC APEX EXPO technical conference presents new research and innovations from key industry players in the areas of board fabrication and design and electronics assembly. In addition to emerging new technologies, there will be a strong focus on the key areas of lead-free soldering and reliability.

Detailed sessions and speakers will be posted after November 1. Sign up now to get notified when registration opens — we’ll send you a special offer!

What problem keeps you up at night? Let us know so we can better shape the conference to meet your needs!

Conference sessions will include:

  • Cleaning
  • Counterfeit Components
  • Design
  • Effect of Flux Residues on Reliability
  • Embedded Components
  • Encapsulation
  • Environmental Issues
  • Flex
  • Halogen Free
  • High Speed
  • High Speed PCB Materials
  • Innovative PCB Processes
  • Inspection
  • Laminate Reliability
  • Lead-Free Reliability 
  • Lead-Free: Surface Effects
  • Levels of Reliability
  • Moisture & Lamination
  • PCB Plating Processes
  • PCB Reliability
  • PCB Reliability Test Methods
  • Reflow Assembly
  • Soldering Processes
  • Stencil Printing
  • Thermal Cycling: Lead-Free Reliability
  • Thermal Management

Are you from a college or university? Submit your abstract and win exposure for your research and findings to the industry and a place on the exhibit floor.

Industry posters are being accepted. Put your research in front of conference attendees and presenters from around the world. Submit your poster abstract.