Supporters

Sponsored by:

• China International Software & Information Service Fair
• China Printed Circuit Association (CPCA)
• European Institute of Printed Circuits (EIPC)
• Hong Kong Printed Circuit Association (HKPCA)
• International Electronics Manufacturing Initiative (iNEMI)
• Indian Printed Circuits Association
• International Microelectronics And Packaging Society (IMAPS)
• Japan Electronics Packaging and Circuits Association (JPCA)
• Japan Robotics Association (JARA)
• JEDEC Solid State Technology Association
• Korea Printed Circuit Association (KPCA)
• Microelectronics Packaging and Test Engineering Council (MEPTEC)
• Surface Mount and Circuit Board Association (SMCBA)
• Taiwan Printed Circuit Association (TPCA)

In Cooperation with:

• Adhesives and Sealants Industry (ASI) Magazine
• Advanced Packaging
• ASSEMBLY
• Chip Scale Review
• Circuit Cellar
• Circuitnet
• CircuiTree
• Circuits Assembly
• Dempa Publications, Inc.
• EMChina.org.cn
• EMSNow
• EMT Worldwide
• Equipment Protection
• Global SMT & Packaging
• iConnect007
• MDeviceNow.com
• Medical Products Outsourcing
• Metal Finishing
• Printed Circuit Design & Fab
• Printed Circuit Journal
• Printed Circuit World
• Reed Business Information Asia
• SMT Magazine
• Surface Mounting World
• Test & Measurement World
• THERMAL News
• U.S. Tech
• Wiring Harness News

Exhibitor Sponsors

Conference Bags — Europlacer

Notepads — MacDermid Incorporated

IPC APEX Trade Show Subcommittee

Chairman: Leo van de Vall, Assembléon America

• Jason Spera, Aegis Industrial Software Corporation
• Mike Konrad, Aqueous Technologies
• Alec J. Babiarz, Asymtek
• Tom Nash, BTU International
• Karen Moore-Watts, DEK International GmbH
• Sebastian Schmidt, ERSA Inc.
• Scott E. Wischoffer, Fuji America Corporation
• Marc Peo, Heller Industries
• Douglas Dixon, Henkel Corporation
• Brian Duffey, MYDATA Automation, Inc.
• Juan A. Arango, Panasonic Factory Solutions Company of America
• Leonard D. Garrison, II (Butch), Siemens Energy & Automation, Inc. 
• Jeff Mogensen, Speedline Technologies Inc.
• Brad Bennett, Universal Instruments Corporation

IPC EXPO Trade Show Subcommittee

Chairman: Fred Johnson, Schmid Systems Inc.

• Rick Lies, Chemcut Corporation
• Art Wolfrum, MacDermid, Inc.
• David Vaughan, Taiyo America, Inc.

Technical Program Committee

Conference Director: Greg Munie, Ph.D.

• Jasbir Bath, Bath Technical Consultancy
• Michael Beauchesne, Amphenol Printed Circuits, Inc.
• Beverley Christian, Ph.D., Research in Motion Limited
• Gary Ferrari, FTG
• Patty Goldman, Dielectric Solutions
• David H. Hoover, Multek
• Kim Hyland, Cisco
• R. Wayne Johnson, Ph.D., Auburn University