Register Today

Social

 IPC TechnetTwitter Facebook YouTube LinkedIn

PCB Executive Management Meeting

February 27, 2012

Get the information you need to lead. Join fellow decision-makers and influencers at the IPC PCB Executive Management Meeting. This unique event is a "can't miss" opportunity to connect and exchange ideas with CEOs and other senior-level leaders.

Agenda

8:00 am Opening Remarks
8:15 am Political and Environmental Issues Impacting the Industry
  • Fern Abrams, Director Government Relations & Environmental Policy, IPC
9:00 am Partnering for Success in the New Economy: Managing Increased Expectations in a Budget Constrained Environment
  • Andrew Hamelynck, Vice President of Mission Assurance, L-3 Communications Telemetry-West
10:00 am Break
10:30 am Market Update 
  • Shawn DuBravac, Chief Economist, Consumer Electronics Association
11:15 am Shoring Trends:  What North American Manufacturers Can Do
  • Joel Yocom, Reshore America
12:00 pm Lunch
1:30 pm International Panel: A Global Perspective of the PCB Industry
  • Walter Moser, CSO Industrial & Automotive Solutions, AT&S Austria Technologie & Systemtechnik AG
  • George Dudnikov, CTO and GM, Zhuhai Founder PCB Development Limited
  • Steve Lach, VP/General Manager — NA Operations, Viasystems Group, Inc.
3:00 pm Break
3:30 pm Roundtable Discussions
5:00 pm Adjournment

Past Attendees of the PCB Executive Management Meeting Include:

  • Advanced Circuits Inc.
  • Alpha Circuit Corporation
  • Alternative Manufacturing Inc.
  • Amphenol Printed Circuits, Inc.
  • Applied Materials
  • AT&S Austria Technologie & Systemtechnik AG
  • Aurora Circuits, LLC
  • Axon Circuit Inc.
  • Bare Board Group
  • Bartlett Manufacturing Company
  • Camtek USA, Inc.
  • Chemcut Corporation
  • Cicor Technologies SA
  • Circuit Connect Inc.
  • CIRE Group
  • CMC Electronics Inc.
  • Colonial Circuits Inc.
  • Coretec Inc.
  • CTS
  • DDi Corp.
  • Delta Circuits Inc.
  • Eastek International
  • Electro Plate Circuitry, Inc.
  • Electropac Co. Inc.
  • Electrotek Corp.
  • Endicott Interconnect Technologies Inc.
  • Enigma Interconnect Inc.
  • Epec LLC
  • Fawn Electronics Company
  • FTG Circuits, Inc.
  • Global Innovation Corp.
  • Graphic Plc
  • HEI Inc.
  • Honeywell
  • Hunter Technology
  • IEC Electronics Corp.
  • IMI Inc.
  • Insulectro
  • IPC Cal Flex Inc.
  • ISM, Inc.
  • Isola Group SARL
  • ITL Circuits
  • K & F Electronics
  • K-Technologies
  • LaBarge Inc.
  • Lincoln International
  • Linea Tergi Ltd.
  • Lockheed Martin Systems Integration
  • Marco Manufacturing Inc.
  • Maskless Lithography
  • Meadville Holdings Limited
  • M-Flex (Multi-Fineline Electronix, Inc.)
  • Micropack Limited
  • Minco Products Inc.
  • ML Circuit
  • Modular Components National, Inc.
  • Moog Components Group-Galax Operations
  • National Technology Inc.
  • Northrop Grumman
  • North Texas Circuit Board Inc.
  • NSWC Crane
  • OEM Worldwide
  • OMG Electronic Chemicals
  • OneSource Group
  • Phoenix International Corp.
  • Pho-Tronics Inc.
  • Polytron-Print GmbH
  • QTI
  • Quality Circuits, Inc.
  • RJR Circuits Inc.
  • Rockwell Collins
  • Royal Circuit Solutions Inc.
  • Saturn Electronics Corporation
  • SiliconPipe, Inc.
  • Sprig Circuits Inc.
  • Strataflex Corporation
  • Sunstone Circuits LLC
  • Teledyne Printed Circuit Technologies
  • Total Electronics, LLC
  • TTM Technologies
  • Universal Circuits Inc.
  • Uyemura International Corp.
  • Viasystems Group, Inc.
  • Viasystems Technology Corp. LLC
  • Vulcan Flex Circuit Corporation
  • Westak
  • Wong's International Corporation