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Need answers on electronics manufacturing and assembly?

You’ve come to the right place. From the basics of SMT to the challenges of lead-free alloys and reliability, IPC APEX EXPO has the courses, conference sessions and standards meetings that you need. In one trip, meet the industry experts and get all of your questions answered.

It’s easy and affordable. Sign up by January 28 and save 20% on any registration fees. Exhibit hall admission is free when you register in advance! Learn more about your registration options or register today.

IPC APEX EXPO is the one place to see all the industry’s leading suppliers in one convenient location.
Your FREE exhibit hall admission gives you access to:

Hundreds of Exhibitors — See and compare equipment and suppliers focused on electronics assembly: equipment such as test/inspection systems; pick and place; rework/repair; and production hand tools & fixtures plus adhesives/dispensers and more.

Free Keynote Sessions
Star Trek’s Captain James T. Kirk, William Shatner, will share his life’s inspirations, his drive to “explore strange new worlds,” and his newly published set of rules to live by. Afterwards, he will sign copies of his book on the show floor.

Grazing into the Crystal Ball — Key industry leaders will predict technology shocks and new opportunities in a lively new session.

FREE! Buzz Sessions — Hot panel discussions on topics such as tin whiskers, conflict minerals, solar, supply chain management plus an international academic paper competition will be thought-provoking and informative.

On the Show Floor — Check out cutting-edge, new products in the New Product Zone, save money in the IPC show floor bookstore, visit the National Physical Laboratory Defect Clinic and catch up with friends at the free Wednesday show floor reception. Plus, watch or participate in the new Hand Soldering Competition, culminating in the Grand Championship on March 1.

This page will give you a short introduction to the technical conference sessions, professional development courses and standards development meetings specific to electronics manufacturing.

Technical Conference

Technologists and researchers from around the world will present their competitively selected papers in this comprehensive technical conference. Sign up for the full three-day conference or just a day. Sessions of special interest in electronics assembly, manufacturing and test include:

S02 Tin Whiskers — Risks, science and prevention of whisker formation
S04 Voiding: Process and Test— Reducing voids, reliability impact and detecting them
S06 Printing — Stencil design and coating choices to ensure the printing process stays a high-output/zero-defect
process
S09 Voiding: Component Effects — The impact of component type on void formation
S11 Solder Joint Morphology —The anatomy of the solder joint and how the reliability impact
S12 Flux — No-clean and VOC fluxes and what to look for
S14 Cleaning — High interconnect density electronics and the VOC emission aspects of defluxing
S16 Lead-Free Alloys — The latest research from industry experts on lead-free alloys
S17 Solder Assembly — Vapor phase soldering, bottom side components and thick, thermally challenging boards
S18 Packaging — The latest on three package types: capacitors, air cavity packages and flip chip ICs
S21 Solder Joint Testing and Performance -- How’s and why’s of alloy choice, process requirements and reliability testing for lead-free solders
S22 Surface Insulation Resistance — A comprehensive look at SIR/CAF and their causes and cures
S25B Coating — Coating as protection for electronic assemblies
S26 Solder Paste — New technologies for solder pastes for lead-free, halogen-free finer pitch packages
S29 Surface Finishes — Lead-free finish performance in unfriendly environments
S31 Pad Cratering — Tests to predict and diagnose pad cratering
S32 BGA Reliability — High reliability applications of large arrays, backwards compatibility and repair

View all conference sessions

Professional Development Courses

Learn from the best experts in half-day courses focused on critical technical issues. With 51 courses to choose from, you’ll find the expertise you need! Electronics assembly topics include:

PD05 and PD06: Troubleshooting SMT (two part course)
PD13 and PD17: Best Practices in Electronics Assembly Processes (two part course)
PD15: Preventing Production Defects and Failures
PD18: Design of Experiment for SMT Processes
PD22: Physics of Failure
PD26: PoP and BTC Assembly - Material, Process and Reliability
PD30: Ball Grid Array (BGA): Principles and Practice
PD31: SMT Process Fundamentals for Tin-Lead and Lead-Free Assembly
PD37: Lead-Free Assembly for High Yields and Reliability
PD39: Design and Assembly Challenges of Ball Grid Arrays (BGAs) and Bottom Termination Components
PD46: Lead-Free for the Exemptee: Surviving in a Lead-Free World
PD51: Practical Tips for Rework of Advanced Packages - Reballing BGAs, Leadless Device Rework

View all courses

Standards Development Meetings

IPC is an ANSI-accredited standards developing organization. Attend a standards meeting and learn more about the standards your company, customers and competitors rely on. Listen in or become a contributor. You’re welcome either way.
Some of the topics for committee meetings specific to electronics assembly, manufacturing or test are: assembly and joining processes (includes task groups for J-STD-001 and specifications for final finishes, flux, solder paste, and underfill adhesives) product assurance (includes IPC-A-610, IPC-A-620, and box build); assembly equipment; environment, health and safety; product reliability and testing.
View All Standards Development Meetings

Want to see what IPC APEX EXPO has for boards, materials and design? Go to our Boards and Materials or Design pages