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Academic Poster Competition
Vote for the Best Academic Poster of 2010 On-Site at the Show
To foster better cooperation between industry and academia in the critical areas of electronic interconnection technology, IPC is sponsoring an “all academic poster competition.”
Voting ended on February 19 and the top 10 best posters have been selected. The authors have been invited to attend IPC APEX EXPO, where industry members will vote for the top three winners on-site. The authors of the top three posters will be awarded with $3,000, $1,000 and $500, for first, second and third places. Winners will be announced at the close of the show floor reception on Wednesday, April 7.
For more information, contact Greg Munie, Conference Director or Toya Richardson at +1 847-597-2825.
Top Ten Academic Posters for 2010
Poster |
Title Submitted By |
Institute |
| Bonding/Barrier Composites on Bismuth Telluride(Bi2Te3) for High Temperature Applications | Wen P. Lin | University of California, Irvine |
| Reliability of Lead-Free Solder Under High Temperature Aging | John Evans | Auburn University |
| Gold to Gold Solid-State Bonding of Silicon Chips to Alumina Substrates | Chu-Hsuan Sha and Chin C. Lee | University of California, Irvine |
A Defect Phase Diagram for Tin Whisker and Local Film Properties Near Whiskers |
P. Sarobol, A.E. Pedigo, P. Su, J.E. Blendell, C.A. Handwerker | Purdue University |
| Use of RF Impedance Analysis for Non-Destructive Sensing of Interconnect Failure Mechanisms | Daeil Kwon | University of Maryland |
| Tin Whisker Growth Related to the Crystallographic Texture of Sn and Sn Alloy Electrodeposits | A.E. Pedigo, P. Sarobol, P. Su, J.E. Blendell, C.A. Handwerker | Purdue University |
| Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor | Amendra Koul | Missouri University of Science and Technology |
| Analysis of Electrochemical Migration Kinetics | Xiaofei He, Michael H. Azarian, Michael Pecht | University of Maryland |
| Lifetime Modeling of an Embedded Planar Capacitor Laminate | Mohammed Alam | University of Maryland |
| Effect of Pb Additions on the Creep and Tensile Behavior of Sn3.0Ag0.5Cu Solder | Jonathon P. Tucker | Purdue University |
“From a student's point of view, IPC APEX EXPO was an excellent opportunity to learn about industrial practices, to share our research and show how it is industrially significant.” —Aaron Pedigo, graduate student, Purdue University “As a participant, I was very impressed with the attendees’ interest and turnout for the academic posters, along with IPC's support.” —Frank L. Collins, Process Engineer, Johns Hopkins University, Applied Physics Laboratory |