IPC APEX EXPO

Professional Development Courses

Sunday, February 25, 2018
9:00 AM – 12:00 PM
PD01 Design for Excellence: DFM (Design for Manufacturing)  DFR (Design for Reliability)  DFA (Design for Assembly) and More - Part 1
Instructor: Dale Lee, Plexus Corp.
PD02 SMT and Through Hole Defect Analysis and Process Troubleshooting - Part 1
Instructor: S. Manian Ramkumar, Rochester Institute of Technology
PD03 PC Board Grounding to Control Noise and EMI
Instructor: Richard Hartley, RHartley Enterprises
PD04 J-STD-001 and Ionic Residue Testing
Instructor: Douglas Pauls, Rockwell Collins
PD05 The Complexities of Fine Pitch BGA Design
Instructor: Susy Webb, Design Science
PD06 Flexible Circuits from Design through Test: Lessons Learned - Part 1
Instructor: Mark Finstad, Flexible Circuit Technologies, Inc.
Instructor: Nick Koop, TTM Technologies
2:00 PM – 5:00 PM
PD07 Design for Excellence: DFM (Design for Manufacturing)  DFR (Design for Reliability)  DFA (Design for Assembly) and More - Part 2
Instructor: Dale Lee, Plexus Corp.
PD08 SMT and Through Hole Defect Analysis and Process Troubleshooting - Part 2
Instructor: S. Manian Ramkumar, Rochester Institute of Technology
PD09 Signal Attenuation in Very High Speed Circuits
Instructor: Richard Hartley, RHartley Enterprises
PD10 Solder Joint Reliability in Electronic Assemblies
Instructor: Jean-Paul Clech, EPSI
PD11 PCB Fabrication Basics: Process and Specification
Instructor: Jim Vanden Hogen, Plexus Corporation
PD12 Flexible Circuits from Design through Test: Lessons Learned - Part 2
Instructor: Mark Finstad, Flexible Circuit Technologies, Inc.
Instructor: Nick Koop, TTM Technologies
Monday, February 26, 2018
9:00 AM – 12:00 PM
PD13 Assembly: Best Practices for Improving Manufacturing Productivity - Part 1
Instructor: Phil Zarrow, ITM Consulting Inc.
Instructor: W. James Hall, ITM Consulting Inc.
PD14 Advanced Rework: Hands-on BGA Reballing and Leadless Devices - Part 1
Instructor: Norman Mier, Instructor, BEST Inc., James Barnhart, BEST Inc.
PD15 Stencil Printing Process and Solder Paste Inspection – An In-Depth Look
Instructor: S. Manian Ramkumar, Rochester Institute of Technology
PD16 Advanced Printed Circuit Board Trouble Shooting. Getting to the root cause of defects - Part 1
Instructor: Michael Carano, RBP Chemical Technology, Inc.
PD17 Achieving Improved Reliability with Failure Analysis
Instructor: Bhanu Sood, NASA Goddard Space Flight Center
PD18 Preventing Defects and Product Failures
Instructor: Jennie Hwang, H-Technologies Group
2:00 PM – 5:00 PM
PD19 Assembly: Best Practices for Improving Manufacturing Productivity - Part 2
Instructor: W. James Hall, ITM Consulting Inc.
Instructor: Phil Zarrow, ITM Consulting Inc.
PD22 Advanced Printed Circuit Board Trouble Shooting. Getting to the root cause of defects - Part 2
Instructor: Michael Carano, RBP Chemical Technology, Inc.
PD20 Advanced Rework: Hands-on BGA Reballing and Leadless Devices - Part 2
Instructor: Norman Mier, Instructor, BEST Inc., James Barnhart, BEST Inc.
PD21 Reflow Soldering Process and Influence on Defects – An In-Depth Look
Instructor: S. Manian Ramkumar, Rochester Institute of Technology
PD23 Routing of Differential Pair Lines to Control Signal Integrity
Instructor: Richard Hartley, RHartley Enterprises
PD24 Part Placement Choices and Consequences
Instructor: Susy Webb, Design Science
Thursday, March 01, 2018
9:00 AM – 12:00 PM
PD25 Electronic Assembly Reliability – Meeting the Challenges of Today’s
Instructor: Umut Tosun, ZESTRON Americas
PD26 Design for Testability and for Cost-Effect Test Strategies with JTAG/Boundary Scan
Instructor: Louis Ungar, Advanced Test Engineering Solutions, Inc.
PD27 Physics of Failure Reliability Predictions: Introduction and New Developments
Instructor: Dock Brown, DfR Solutions
PD28 Non-contact additive technologies in electronics production
Speaker: Gustaf Mårtensson, Mycronic AB
PD29 How to Insure a Compliant ESD Program
Instructor: Robert Hanson, Americom Seminars
PD30 New Developments in Selective Soldering Technology
Instructor: Bob Klenke, ITM Consulting Inc.