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Call for Participation for 2014

Still accepting Abstract Submissions for Technical Conference!

Technical Conference: March 25–27, 2014
Professional Development Courses: March 23, 24 and 27, 2014

Submit an abstract for the industry’s premier technical conference or provide a course proposal for one of its largest educational events. Presenting at IPC APEX EXPO 2014 in Las Vegas will provide significant visibility for you and your company. Thousands of individuals will receive the technical proceedings of the conference, ensuring that your published paper is seen by key engineers, managers and executives from all segments of the worldwide electronic interconnection industry. Presenting a technical conference paper or teaching a professional development course is a unique and cost-effective channel to promote your expertise and your organization to your customers and prospects.

Conference and Course Topics

Submissions are sought on design, materials, assembly, processes and equipment in the following areas:

  • Adhesives
  • Advanced Technology
  • Area Array/Flip Chip/0201
  • Assembly and Rework Processes
  • BGA Packaging
  • Black Pad and Other Board Related Issues
  • BTC/QFN/MLF
  • Business & Supply Chain Issues
  • Conformal Coatings
  • Counterfeit Electronics
  • Design
  • Electromigration
  • Electronics Manufacturing Services
  • Embedded Passive & Active Devices
  • Environmental Compliance
  • Head-in-Pillow, Component &
    Board Warpage
  • Lean Six Sigma
  • Flexible Circuitry
  • HDI Technologies
  • High Speed, High Frequency & Signal Integrity
  • Lead Free Fabrication, Assembly & Reliability
  • Microminiaturization
  • Nanotechnology
  • Optoelectronics
  • Packaging & Components
  • PCB Fabrication
  • PCB and Component Storage & Handling
  • Performance, Quality & Reliability
  • Photovoltaics
  • PoP
  • Printed Electronics
  • RFID Circuitry
  • Soldering
  • Surface Finishes
  • Test, Inspection & AOI
  • Tin Whiskers
  • Underfills
  • Via Plugging & Other Protection
  • 2.5-D/3-D Packaging

Technical Conference

Requirements for Submission

Call for ParticipationProvide an abstract of approximately 300 words that summarizes technical work covering case histories, research and discoveries. It must be received by May 31, 2013. Authors of papers selected for the conference will receive a detailed speaker manual to assist them with numerous items, including the formatting of their paper and presentation slides.

The selection process is competitive and sufficient detail needs to be included to allow the Technical Program Committee to properly assess content of the proposed paper. If selected, papers and presentation slides will be due October 5, 2013. The paper should be noncommercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Presentations will be limited to 30 minutes including 5–10 minutes for questions and answers.

Conference Benefits

Conference speakers are entitled to a free one-day conference pass for the day of their presentation, discounted registration fees for the full conference and complimentary admission to the exhibit hall. All speakers selected for presentation who provide their papers to IPC by September 7, 2013, will be eligible for a free full conference pass.

Conference Awards

To recognize exceptional achievement, awards will be presented for “Best U.S. Paper” for U.S. authors and “Best International Paper” for authors from outside the United States. Each award consists of a recognition plaque and a $1,000 prize. Co-authors share the honorarium but all will receive individual recognition plaques.

Please note: Previously published papers or commercially-focused papers are not appropriate and will not be accepted.

Professional Development Courses

Course proposals are solicited from individuals interested in teaching half-day (three hours) professional development courses on design, manufacturing processes and materials to classes up to 50 persons. Proposals, including course descriptions, must be submitted by May 31, 2013. Final presentations must be submitted by October 5, 2013. Travel expenses and honorariums are offered to professional development instructors.


Submit Your Technical Conference Paper Abstract Online

Submit your conference paper abstracts online

For more information about conference participation, please contact Conference Director Jasbir Bath at JasbirBath@ipc.org or IPC Technical Programs Coordinator Toya Richardson at ToyaRichardson@ipc.org or +1 847-597-2825.

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Conference Paper Timeline Professional Development Timeline
Abstracts due: May 31, 2013 Proposals due: May 31, 2013
Acceptance by June 15, 2013 Acceptance by:  June 15, 2013
Papers / Presentations Due:  October 5, 2013 Coursework Due: October 5, 2013