Call for Posters
IPC APEX EXPO™
March 29—April 2, 2009
Las Vegas, Nevada
On Design, Printed Boards, Electronics Assembly and Test
Submit an abstract for the industry’s premier conference on electronics manufacturing.
Gain significant visibility for you and your company on your research and knowledge.
Thousands of individuals will attend IPC APEX EXPO, ensuring that your work is
seen by key engineers, managers and executives from all segments of the electronic
interconnect industry worldwide. The move to Las Vegas last year raised global
exposure of presenters due to the worldwide appeal of this world-famous destination.
Poster Topics
Submissions are sought in all areas of the electronics industry, including design,
materials, assembly, processes, and equipment, especially:
- Design
- Embedded Passive & Active Devices
- Flexible Circuitry
- High Frequency
- Lead-Free Issues
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- Fabrication
- Rework & Repair
- RFID Circuitry
- SMT Assembly
- Test & Inspection
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Requirements for Submission
Provide an abstract of up to 300 words that summarizes technical and previously
unpublished, non-commercial work covering case histories, research and discoveries.
It must be received by January 30, 2009.
Conference Benefits
Conference speakers are entitled to a copy of the Proceedings and a free One-Day
Conference Pass for the day of your presentation.
Please Note: Previously published papers and papers focused on a company or
its products are not appropriate and will not be accepted.
For more information about poster participation or if you have any other interest in
participating, contact Greg Munie, Ph.D., IPC Technical Conference Director, at
GregMunie@ipc.org or Toya Richardson, IPC Technical
Administrative Assistant, at ToyaRichardson@ipc.org
or +1 847-597-2825.
All fields marked with an * are mandatory.
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