Call for Posters
Deadline: November 23, 2012
Show a technical poster at the industry's premier conference on electronics
manufacturing. Gain significant visibility for you and your company on your
research and knowledge. Thousands of individuals will attend IPC APEX EXPO,
ensuring that your work is seen by key engineers, managers and executives from
all segments of the electronic interconnect industry worldwide. Posters will be
displayed throughout the event. Poster presentations are scheduled for
Wednesday, February 20, 2013, offering additional visibility.
Poster Topics
Submissions are sought in all areas of the electronics industry, including design,
materials, assembly, processes, and equipment, especially:
- Design
- Embedded Passive & Active Devices
- Flexible Circuitry
- High Frequency
- Lead-Free Issues
- Printed Board Fabrication
- Rework & Repair
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- RFID Circuitry
- SMT Assembly
- Test & Inspection
- Printed Electronics
- Packaging & Components
- Surfaces Finishes
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Requirements for Submission
Provide an abstract of up to 300 words that summarizes technical and previously
unpublished work covering case histories, research and discoveries.
Poster Presenter Benefits
Poster presenters are entitled to a free One-Day Conference Pass for Wednesday,
February 20, 2013.
For more information about poster participation or if you have other interest in
participating, contact Greg Munie, Ph.D., IPC technical conference director, at
GregMunie@ipc.org or Toya Richardson, IPC technical
administrative assistant, at ToyaRichardson@ipc.org
or +1 847-597-2825.
All fields marked with an * are mandatory.
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